FET, MOSFET Arrays IRF7325TRPBF product image

IRF7325TRPBF

  • Description:MOSFET 2P-CH 12V 7.8A 8SO
  • Series:HEXFET®

SKU:e62fd2b25642 Category: Brand:

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IRF7325TRPBF is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 2P-CH 12V 7.8A 8SO. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for IRF7325TRPBF

  • Description:MOSFET 2P-CH 12V 7.8A 8SO
  • Series:HEXFET®
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 P-Channel (Dual)
  • FET Feature:Logic Level Gate
  • Drain to Source Voltage (Vdss):12V
  • Current - Continuous Drain (Id) @ 25°C:7.8A
  • Rds On (Max) @ Id, Vgs:24mOhm @ 7.8A, 4.5V
  • Vgs(th) (Max) @ Id:900mV @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:33nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds:2020pF @ 10V
  • Power - Max:2W
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SO
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for IRF7325TRPBF

IRF7325TRPBF

FET, MOSFET Arrays Overview

The IRF7325TRPBF is a dual P-channel HEXFET power MOSFET in an SO-8 package. It features a -12V drain-source voltage and continuous drain currents of -7.8A at 25°C and -6.2A at 70°C. The device offers ultra-low on-resistance, specified as 24mΩ at VGS=-4.5V and 33mΩ at VGS=-2.5V. Thermal resistance from junction to ambient is 62.5°C/W, with a maximum power dissipation of 2.0W at 25°C. Operating temperatures range from -55°C to +150°C.

FET, MOSFET Arrays Feature Summary

  • Dual P-channel configuration within a single low-profile SO-8 package for space-efficient designs.
  • Ultra-low on-resistance achieved through advanced Trench Technology processing.
  • Enhanced thermal characteristics via customized leadframe design suitable for vapor phase or wave soldering.

FET, MOSFET Arrays Applications

  • Power management circuits requiring compact dual-switch solutions.
  • Low-voltage DC-to-DC converter topologies.
  • Load switching applications in portable electronic devices.

FET, MOSFET Arrays Procurement Notes

Verify the component matches the specific Infineon/IR part number IRF7325TRPBF. Confirm the package type is SO-8 and that the device is lead-free. Ensure the supplier provides valid traceability documentation consistent with the manufacturer's standards for consumer market qualification.

FET, MOSFET Arrays Selection Notes

Select this component for applications needing two P-channel switches in a small footprint. Evaluate thermal performance against the 62.5°C/W junction-to-ambient resistance. Consider the -12V rating and current derating curves when designing for high-temperature environments above 25°C.

FET, MOSFET Arrays Part Context

This device belongs to the HEXFET family utilizing Trench Technology. It is designed for consumer market applications. The SO-8 package allows for multiple-die capability and improved thermal handling compared to standard variants.

FET, MOSFET Arrays Replacement Considerations

Check datasheets for alternative dual P-channel MOSFETs in SO-8 packages with similar -12V ratings and on-resistance values below 50mΩ. Verify pinout compatibility and thermal resistance specifications before substitution.

FET, MOSFET Arrays FAQ

What is the maximum gate-to-source voltage?

The absolute maximum gate-to-source voltage is ±8.0V.

How does the on-resistance vary with gate voltage?

RDS(on) increases as gate voltage decreases; it is 24mΩ at -4.5V, 33mΩ at -2.5V, and 49mΩ at -1.8V.

Is this device suitable for high-reliability aerospace applications?

No, the datasheet states the product has been designed and qualified for the consumer market.

IRF7325TRPBFIRF7325TRPBF

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