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Product Detailed Parameters
- Description：IGBT 1200V 11A D2PAK
- Series：-
- Mfr：Infineon Technologies
- Package：Tape & Reel (TR)
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：11:00 AM
- Current - Collector Pulsed (Icm)：22 A
- Vce(on) (Max) @ Vge, Ic：4.3V @ 15V, 5A
- Power - Max：60 W
- Switching Energy：450µJ (on), 440µJ (off)
- Input Type：Standard
- Gate Charge：28 nC
- Td (on/off) @ 25°C：23ns/93ns
- Test Condition：960V, 5A, 50Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Supplier Device Package：D2PAK
- Grade：-
- Qualification：-
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Overview
The IRG4BH20K-STRLP is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by Infineon Technologies. It features a collector-emitter breakdown voltage of 1200 V and a maximum continuous collector current of 11 A. The device operates within a temperature range of -55°C to +150°C and has a power dissipation rating of 60 W. Packaged in a surface-mount D2PAK (TO-263) with three pins, it is designed for high-frequency switching applications up to 20 kHz.
Feature Summary
- High-voltage capability with 1200 V collector-emitter breakdown rating
- Surface-mount D2PAK package design for automated assembly
- Optimized for ultrafast switching operations between 4 and 20 kHz
Applications
- Motor drive inverters
- Switched-mode power supplies
- Induction heating systems
Procurement Notes
Verify the specific suffix 'STRLP' against official Infineon documentation to confirm tape-and-reel packaging specifications. Confirm that the component status is acceptable for new designs, as availability may be limited due to obsolescence. Ensure thermal management solutions align with the 60 W dissipation rating in the D2PAK package.
Selection Notes
Select this IGBT when a 1200 V rating is required for high-power density applications. The D2PAK form factor suits space-constrained PCB layouts compared to through-hole alternatives. Evaluate thermal resistance requirements carefully, as the surface-mount package relies on board copper area for heat dissipation under the 60 W limit.
Part Context
This component belongs to the IRG4BH series of single IGBTs from Infineon. It shares the core die technology with variants like the IRG4BC40WPBF but differs in packaging and current handling capabilities. The STRLP suffix specifically denotes the reel packaging format for surface-mount technology production lines.
Replacement Considerations
Direct pin-compatible replacements are not explicitly confirmed in public data. Consider the IRG4BH20K-SPBF for tube-packaged equivalents or evaluate newer generations from the same manufacturer for improved performance metrics.
