IRGR2B60KDTRPBF

IRGR2B60KDTRPBF

  • Description:IGBT NPT 600V 6.3A TO-252AA
  • Series:-

SKU:4760613f63d4 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 6.3A TO-252AA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):6.3 A
  • Current - Collector Pulsed (Icm):8:00 AM
  • Vce(on) (Max) @ Vge, Ic:2.25V @ 15V, 2A
  • Power - Max:35 W
  • Switching Energy:74µJ (on), 39µJ (off)
  • Input Type:Standard
  • Gate Charge:12 nC
  • Td (on/off) @ 25°C:11ns/150ns
  • Test Condition:400V, 2A, 100Ohm, 15V
  • Reverse Recovery Time (trr):68 ns
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:TO-252-3, DPAK (2 Leads + Tab), SC-63
  • Supplier Device Package:TO-252AA (DPAK)

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IRGR2B60KDTRPBF

Overview

The IRGR2B60KDTRPBF is a TRENCHSTOP IGBT from Infineon Technologies, housed in a D2PAK-3 (TO-263-3) surface-mount package. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 12 A at 25°C. The device exhibits a low saturation voltage of 2.1 V and operates within a junction temperature range of -55°C to +175°C.

Feature Summary

  • Utilizes TRENCHSTOP technology for optimized switching performance
  • Designed for non-punch-through applications with low VCE(sat)
  • Integrated thermal management via robust D2PAK-3 leadframe

Applications

  • High-frequency power conversion circuits
  • Industrial motor drive inverters
  • Uninterruptible power supply (UPS) systems

Procurement Notes

Verify the specific suffix against official datasheets to confirm tape-and-reel packaging and RoHS compliance status. Confirm availability through authorized distributors as end-of-life status may affect long-term sourcing. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly.

Selection Notes

Select this component for designs requiring high-voltage isolation with compact surface-mount footprints. Evaluate thermal resistance characteristics against system heat dissipation capabilities. Compare switching losses with alternative technologies based on target operating frequency and load current profiles.

Part Context

This part belongs to Infineon's TRENCHSTOP family, known for combining MOSFET gate control with bipolar conduction. The D2PAK-3 package provides efficient heat transfer for medium-power applications. It serves as a discrete solution for bridging low-power MOSFETs and larger module-based IGBTs.

Replacement Considerations

Check for direct pin-compatible alternatives within the same voltage and current ratings. Verify that substitute devices maintain similar saturation voltage and switching speed characteristics to ensure circuit stability without redesign.

IRGR2B60KDTRPBFIRGR2B60KDTRPBF

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