ISL3159EFUZ-T7A

Overview

The ISL3159EFUZ-T7A is a half-duplex RS-485 transceiver manufactured by Renesas Electronics. It operates with a single 5 V supply and supports data rates up to 40 Mb/s. The device features a DFN-EP-10 package for surface mount applications. It includes an integrated shutdown mode that reduces power consumption significantly. The component is rated for operation within a temperature range of -40 °C to +125 °C.

Feature Summary

• IEC 61000-4-2 ESD protection rated at ±15 kV air discharge and ±8 kV contact discharge
• Fail-safe receiver design ensures a high logic state when the bus is open or idle
• Low current consumption in active mode with dedicated shutdown capability

Applications

• Industrial automation networks requiring robust communication
• Building automation systems utilizing RS-485 buses
• Data acquisition systems operating in electrically noisy environments

Procurement Notes

Verify the specific suffix T7A indicates tape and reel packaging configuration. Confirm the EFUZ variant corresponds to the DFN-EP-10 package type. Check for RoHS compliance documentation as required by project specifications. Ensure the source provides valid traceability records for this discontinued Intersil product line.

Selection Notes

Select this component for designs requiring 5 V operation with high-speed data transmission up to 40 Mb/s. The DFN-EP-10 package offers thermal performance benefits for compact layouts. Verify that the system voltage matches the specified 5 V requirement. Consider the shutdown feature if power management is critical for the application.

Part Context

This part belongs to the ISL3159E series, which focuses on ruggedized RS-485 communication interfaces. The series is characterized by high ESD immunity and fail-safe receivers. It serves as a bridge between low-voltage digital logic and differential bus lines in industrial settings.

Replacement Considerations

The ISL3159EIBZ is a pin-compatible alternative available in an SOIC-8 package. Designers must account for the physical footprint difference between the DFN-EP-10 and SOIC-8 packages during PCB layout adjustments.