IXGN50N60BD3

IXGN50N60BD3

$15.11
  • Description:IGBT MOD 600V 75A 250W SOT227B
  • Series:HiPerFAST™

SKU:e975022644d8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MOD 600V 75A 250W SOT227B
  • Series:HiPerFAST™
  • Mfr:IXYS
  • Package:Tube
  • IGBT Type:-
  • Configuration:Single
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 50A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SOT-227-4, miniBLOC
  • Supplier Device Package:SOT-227B
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):75 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):200 µA
  • Input Capacitance (Cies) @ Vce:4.1 nF @ 25 V

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IXGN50N60BD3

Overview

The IXGN50N60BD3 is a HiPerFAST IGBT with an integrated HiPerFRED diode, housed in the miniBLOC (SOT-227B) package. It features a collector-emitter voltage of 600 V and a continuous collector current of 75 A at 25°C. The saturation voltage is 2.5 V at 90 A. Operating temperature ranges from -40°C to +150°C. Key electrical parameters include a gate charge of 110 nC, turn-off time of 150 ns, and power dissipation of 150 W.

Feature Summary

  • Integrates HiPerFAST IGBT and HiPerFRED diode for high-speed switching
  • Utilizes miniBLOC package with aluminum nitride isolation for high power density
  • Features low package inductance for easy drive and protection

Applications

  • AC motor speed control
  • DC servo and robot drives
  • DC choppers
  • Buck converters

Procurement Notes

Verify datasheet version and revision history before procurement. Confirm pinout compatibility as the BD3 variant differs from BD2. Ensure thermal interface materials match the miniBLOC mounting requirements. Check RoHS compliance status against local regulations.

Selection Notes

Select based on required current handling and switching frequency. Consider thermal resistance values for heatsink design. Verify gate drive voltage compatibility with the specified threshold. Evaluate reverse recovery characteristics for diode applications.

Part Context

Part of the IXYS HiPerFAST family, designed for high-power applications. The miniBLOC package offers superior thermal performance compared to standard TO-247 packages. Suitable for industrial and automotive power electronics requiring compact form factors.

Replacement Considerations

Direct replacement requires verifying pinout differences between BD2 and BD3 variants. Thermal resistance and package dimensions must be compatible. Electrical parameters should closely match to ensure circuit stability.

IXGN50N60BD3IXGN50N60BD3
$15.11
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