SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
KGF20N05D is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is MOSFET 2N-CH 5.5V 20A 20WLCSP. Review the specifications below when checking this part for your BOM.
The KGF20N05D is a dual N-channel power MOSFET featuring a 5.5V drain-to-source voltage rating and a continuous drain current of 20A. It utilizes a 20-bump WLCSP package with a die size of 2.475mm x 1.170mm. The device achieves an on-state resistance (rDS(ON)) as low as 1.6mΩ at VGS = 4.5V and ID = 10A per MOSFET, or 0.8mΩ in parallel configuration. Total gate charge (Qg) is typically 6.7nC at VGS = 4.5V. Operating junction temperature ranges from -55°C to +150°C.
Verify the specific ordering suffix and reel specifications against Renesas technical briefs TB347 and TB363 before procurement. Confirm moisture sensitivity level (MSL) ratings and Pb-free reflow profiles according to TB493 to ensure compatibility with your assembly line requirements. Ensure the component marking location on the bottom of the part aligns with your automated optical inspection setup.
Select this component when board space is constrained due to its small footprint WLCSP package. Evaluate thermal performance based on the specified thermal resistance values for FR-4 substrates. Consider the parallel connection option if lower on-state resistance is required for high-current applications. Verify that the 5.5V voltage rating meets the system's maximum operating conditions.
The KGF20N05D belongs to Renesas' dual N-channel 5.5V power MOSFET family, which also includes parts like the KGF16N05D and KGF6N05D. These devices share similar fabrication technologies integrating CMOS and WLCSP processes. They are designed to offer high power density and low vertical profiles suitable for modern compact electronic designs.
Direct substitutes within the same series include the KGF16N05D and KGF6N05D. When replacing, verify that the alternative part's current handling capabilities and on-state resistance meet the original design requirements. Ensure the package dimensions and pinout remain compatible with the existing PCB layout.
The typical thermal resistance (θJA) is 5°C/W when mounted on a 1-inch square 2oz copper clad FR-4 substrate.
When connected in parallel, the on-state resistance drops significantly; it is typically 0.80mΩ at VGS = 4.5V and ID = 10A, compared to 1.60mΩ for a single MOSFET.
The maximum pulsed drain current (IDM) is rated at 40A.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.