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KSH29CTF is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS NPN 100V 1A DPAK. Review the specifications below when checking this part for your BOM.
The KSH29CTF is an NPN silicon epitaxial planar transistor manufactured by onsemi, designed for general-purpose switching and amplification applications. It utilizes a TO-251-3 (DPAK) surface-mount package to facilitate automated assembly while maintaining robust thermal performance. The device supports a maximum continuous collector current of 1 A and withstands a collector-emitter voltage of 100 V. With a power dissipation rating of 15 W and a transition frequency of 3 MHz, it operates reliably across a temperature range from -65°C to +150°C.
Verify the specific suffix 'TF' against official manufacturer documentation to confirm exact tape-and-reel packaging specifications. Confirm RoHS compliance status directly with the supplier or datasheet, as environmental declarations can vary by production batch. Ensure the component matches the required lead-free standards for your assembly process before finalizing procurement orders.
Select this component when a single NPN transistor with 100 V collector-emitter voltage and 1 A continuous current capacity is required in a surface-mount format. The TO-251-3 package offers a balance between power handling and board space efficiency. Consider the 3 MHz transition frequency for moderate-speed switching applications rather than high-frequency RF designs.
This part belongs to the KSH series of bipolar junction transistors from onsemi. These devices are engineered for robust performance in standard electronic assemblies. The series provides standardized electrical parameters suitable for widespread industrial and consumer electronics applications requiring reliable NPN switching capabilities.
Consult official cross-reference guides for verified substitutes. Generic equivalents may differ in saturation voltage or gain bandwidth. Verify pinout compatibility and thermal resistance values before implementing any alternative components in existing designs.
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