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MADP-000235-10720T is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 35V 7.5W. Review the specifications below when checking this part for your BOM.
The MADP-000235-10720T is a surface-mountable PIN diode in a non-magnetic rectangular MELF SMQ ceramic package. It utilizes HIPAX technology for low inductance and hermetic sealing with extremely low permeability. The passivated chip features full-face bonding to minimize electrical and thermal resistance. Designed for RF coil protection and tuning in MRI applications, it operates from -55°C to +150°C. Key electrical parameters include a reverse voltage of 35V, capacitance of 1.2pF, series resistance of 0.5Ω, parallel resistance of 5kΩ, thermal resistance of 20°C/W, power dissipation of 7.5W, and carrier lifetime of 0.3µs.
Verify the specific revision level (Rev. V1) against current MACOM documentation before procurement. Confirm RoHS compliance status and tin-plated terminal specifications for solderability requirements. Ensure storage conditions avoid high humidity to prevent oxidation of the solderable surfaces prior to assembly.
Select this component when non-magnetic properties are critical for MRI compatibility. Evaluate the 1.2pF capacitance and 0.5Ω series resistance against circuit impedance requirements. Consider the 7.5W power dissipation rating and 20°C/W thermal resistance for heat management in enclosed RF coil assemblies.
This device belongs to M/A-COM's HIPAX technology family, utilizing non-magnetic plating processes. It replaces magnetic variants like MA4PH235-1072T in sensitive magnetic field environments. The 1072 package style supports automated pick-and-place assembly with vacuum or key jaw techniques.
MA4PH235-1072T: Magnetic variant; unsuitable for MRI. MA4P7461F-1072T: Non-magnetic alternative; verify electrical parameter differences.
No, it uses a unique non-magnetic plating process providing extremely low permeability.
The device operates up to +150°C.
It is full-face bonded on both cathode and anode to maximize contact area.
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