RF Switches MASW-003102-13590W product image

MASW-003102-13590W

$34.42
  • Description:IC RF SWITCH SP3T 18GHZ DIE
  • Series:HMIC™
  • Mfr:MACOM Technology Solutions
  • Package:Tray

SKU:1a53c134a245 Category: Brand:

  
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MASW-003102-13590W is listed in the RF Switches range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is IC RF SWITCH SP3T 18GHZ DIE. Review the specifications below when checking this part for your BOM.

RF Switches specifications for MASW-003102-13590W

  • Description:IC RF SWITCH SP3T 18GHZ DIE
  • Series:HMIC™
  • Mfr:MACOM Technology Solutions
  • Package:Tray
  • Product Status:Active
  • RF Type:ISM
  • Topology:-
  • Circuit:SP3T
  • Frequency Range:2GHz ~ 18GHz
  • Isolation:40dB
  • Insertion Loss:1.3dB
  • Test Frequency:18GHz
  • Impedance:50Ohm
  • Voltage - Supply:-
  • Operating Temperature:-65°C ~ 125°C
  • Mounting Type:-
  • Package / Case:Die
  • P1dB:-
  • IIP3:-
  • Features:-
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

RF Switches datasheet and documents for MASW-003102-13590W

MASW-003102-13590W

RF Switches Overview

The MASW-003102-13590W is a single-pole triple-throw (SP3T) RF switch IC manufactured by MACOM Technology Solutions. Designed for ISM applications, this device operates within a frequency range of 2 GHz to 18 GHz. It features an insertion loss of 1.3 dB and provides typical isolation of 40 dB. The component utilizes silicon technology and is supplied in a die package format.

RF Switches Feature Summary

  • Single-pole triple-throw topology with integrated bias networks
  • Broadband operation covering 2 GHz to 18 GHz
  • High isolation performance of 40 dB
  • Low insertion loss of 1.3 dB

RF Switches Applications

  • ISM band signal routing
  • Broadband RF switching systems
  • Wireless infrastructure components

RF Switches Procurement Notes

Verify the specific die configuration and handling requirements prior to integration, as the component is supplied as a bare die rather than a packaged module. Confirm that the design supports the necessary bias network integration and thermal management suitable for silicon-based RF switches operating at high frequencies. Ensure compatibility with the intended PCB layout for die attachment and bonding.

RF Switches Selection Notes

Select this component when a broadband SP3T switch is required for frequencies up to 18 GHz with low loss characteristics. Consider the die form factor and ensure the manufacturing process accommodates bare die assembly. Evaluate the 40 dB isolation requirement against system specifications to confirm adequate signal separation for the intended application environment.

RF Switches Part Context

This part belongs to the MASW series of RF switches from MACOM Technology Solutions. It is related to the MASW-002102-13580, which offers a similar broadband design but in an SP2T configuration. Both devices utilize integrated bias networks and are designed for high-performance RF applications requiring reliable signal switching across wide frequency bands.

RF Switches Replacement Considerations

The MASW-002102-13580 serves as a functional alternative if a dual-throw configuration is acceptable. Verify pinout and electrical parameter compatibility before substitution. No other direct public substitutes are confirmed in the provided documentation.

MASW-003102-13590WMASW-003102-13590W
$34.42
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