Diode Arrays MBR3045STG product image

MBR3045STG

$0.73
  • Description:DIODE ARR SCHOTT 45V 15A TO220AB
  • Series:SWITCHMODE™

SKU:4dc4cbdc2faa Category: Brand:

  
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MBR3045STG is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is DIODE ARR SCHOTT 45V 15A TO220AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for MBR3045STG

  • Description:DIODE ARR SCHOTT 45V 15A TO220AB
  • Series:SWITCHMODE™
  • Mfr:Fairchild Semiconductor
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):45 V
  • Current - Average Rectified (Io) (per Diode):15A
  • Voltage - Forward (Vf) (Max) @ If:620 mV @ 15 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:200 µA @ 45 V
  • Operating Temperature - Junction:-65°C ~ 175°C
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Supplier Device Package:TO-220AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for MBR3045STG

MBR3045STG

Diode Arrays Overview

The MBR3045STG is a dual common cathode Schottky barrier rectifier manufactured by onsemi, formerly Fairchild Semiconductor. It features a silicon construction housed in a TO-220-3 through-hole package. The device supports a maximum average forward current of 30 A and a repetitive peak reverse voltage of 45 V. Key electrical parameters include a maximum forward voltage of 820 mV at rated current, a non-repetitive peak forward surge current of 150 A, and a maximum reverse leakage current of 200 uA. It operates within a temperature range of -65 °C to +175 °C junction temperature.

Diode Arrays Feature Summary

  • Dual common cathode configuration for efficient bridge-less PFC or polarity protection circuits
  • Low forward voltage drop characteristic to minimize conduction losses and improve system efficiency
  • Guardring structure provides enhanced ruggedness and long-term reliability against overvoltage conditions
  • High frequency operation capability suitable for switching mode power supply applications

Diode Arrays Applications

  • Freewheeling diodes in low voltage high frequency rectifier circuits
  • DC-to-DC converters requiring high efficiency and fast recovery
  • Polarity protection applications in electronic systems
  • Bridge-less Power Factor Correction (PFC) circuits

Diode Arrays Procurement Notes

Verify the manufacturer origin carefully as this part number is historically associated with Fairchild Semiconductor but is now produced and distributed by onsemi following their acquisition. Confirm that the specific ordering suffix matches the required package variant and compliance standards such as RoHS and REACH before finalizing procurement orders to ensure component authenticity and regulatory adherence.

Diode Arrays Selection Notes

Select this component when designing circuits requiring a 30 A continuous current rating with a 45 V reverse voltage withstand capability. The TO-220-3 package is appropriate for applications where through-hole mounting and direct heatsinking are preferred. Ensure the thermal management design accounts for the 820 mV forward voltage drop at full load to maintain junction temperatures within the specified 175 °C maximum limit during continuous operation.

Diode Arrays Part Context

This device belongs to the MBR series of Schottky barrier rectifiers, widely utilized in power electronics for its superior switching characteristics compared to standard PN junction diodes. The dual common cathode topology allows for compact implementation of full-wave rectification or synchronous rectification emulation without the need for external diode pairs, simplifying PCB layout and reducing component count in high-current power stages.

Diode Arrays Replacement Considerations

The MBR3045CTG is a verified equivalent part number from onsemi offering identical electrical specifications and pinout compatibility. Designers should verify that any substitute maintains the same TO-220-3 package dimensions and thermal resistance characteristics to ensure seamless integration into existing board layouts without mechanical modification.

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