MBRB1060CTQ-TP

Diode Arrays Overview

The MBRB1060CTQ-TP is a dual common cathode Schottky barrier rectifier manufactured by Micro Commercial Components. It features a D2PAK (TO-263) surface-mount package with four terminals. The device supports an average forward current of 10 A and a peak repetitive reverse voltage of 60 V. Key electrical parameters include a maximum forward voltage of 0.72 V at 5 A, a non-repetitive peak surge current of 150 A, and a thermal resistance from junction to case of 0.57 °C/W. It operates within a temperature range of -55°C to +150°C.

Diode Arrays Feature Summary

• Fully automotive qualified to AEC-Q101 standards
• Halogen-free "Green" device compliant with environmental directives
• Epoxy meets UL 94 V-0 flammability rating
• Moisture sensitivity level 1 classification

Diode Arrays Applications

• Automotive electronics power supply circuits
• DC-DC converter output rectification
• Free-wheeling diodes in inductive load protection
• Low voltage high frequency rectification

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official MCC documentation to confirm packaging type and compliance status. Ensure procurement channels are authorized distributors to guarantee part authenticity and traceability. Confirm that the component meets the required automotive qualification standards for the intended application environment before finalizing orders.

Diode Arrays Selection Notes

Select this component for applications requiring high efficiency and low forward voltage drop in compact surface-mount designs. The D2PAK package provides robust thermal performance suitable for high-current scenarios. Verify that the 60 V reverse voltage rating exceeds the maximum circuit operating voltage to ensure reliable blocking capability under all conditions.

Diode Arrays Part Context

This component belongs to the MBRB series of Schottky rectifiers designed for general-purpose and automotive applications. The Q suffix indicates AEC-Q101 automotive qualification, while the TP suffix designates tape-and-reel packaging. It utilizes silicon technology to achieve fast switching speeds and low reverse leakage currents compared to standard PN junction diodes.

Diode Arrays Replacement Considerations

Cross-reference pinout configurations and thermal resistance values when substituting. Verify that alternative components meet the same AEC-Q101 automotive qualification requirements if used in automotive systems. Ensure the replacement package matches the D2PAK footprint dimensions for proper board compatibility.