MBRF2545CT

Diode Arrays Overview

The MBRF2545CTG is a Switch-mode Schottky Power Rectifier manufactured by onsemi. It utilizes the Schottky Barrier principle in a large area metal-to-silicon power diode with epitaxial construction, oxide passivation, and metal overlay contact. The device features matched dual die construction and is housed in an electrically isolated TO-220 Fullpak package (Case 221D). Key electrical ratings include a peak repetitive reverse voltage of 45 V, an average rectified forward current of 12.5 A per leg (25 A total), and a non-repetitive peak surge current of 150 A. Maximum thermal resistance from junction to case is 3.5 °C/W.

Diode Arrays Feature Summary

• Highly stable oxide passivated junction for reliability
• Very low forward voltage drop for high efficiency
• Matched dual die construction for balanced performance
• Electrically isolated package requiring no isolation hardware

Diode Arrays Applications

• Rectifiers in very low-voltage, high-frequency switching power supplies
• Free wheeling diodes
• Polarity protection diodes

Diode Arrays Procurement Notes

Verify the specific ordering suffix 'G' indicates a Pb-Free package compliant with RoHS standards. Confirm the package type is TO-220 Fullpak (Case 221D) and check for any specific assembly or polarity marking requirements relevant to your manufacturing process. Ensure compatibility with the maximum lead temperature of 260°C for soldering purposes.

Diode Arrays Selection Notes

Select this component for applications requiring high dv/dt capability and excellent ability to withstand reverse avalanche energy transients. The guardring provides stress protection, making it suitable for demanding environments. Consider the 175°C operating junction temperature range and the 4500 V RMS isolation voltage when designing circuits that require robust electrical isolation between leads and heatsink.

Diode Arrays Part Context

This device belongs to the Switch-mode Schottky Power Rectifier series from onsemi. It is designed specifically for use in power management applications where low forward voltage and high efficiency are critical. The TO-220 Fullpak package allows for direct mounting to heatsinks without additional isolation hardware, simplifying thermal management in compact designs.

Diode Arrays Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

Diode Arrays FAQ

What is the maximum RMS isolation voltage?

The maximum RMS isolation voltage is 4500 V, measured between the leads and the heatsink with all leads shorted together.

Does the device require isolation hardware for mounting?

No, the device is electrically isolated and does not require isolation hardware for mounting.

What is the maximum thermal resistance from junction to case?

The maximum thermal resistance from junction to case is 3.5 °C/W per leg.