FET, MOSFET Arrays MCB40P1200LB-TRR product image

MCB40P1200LB-TRR

  • Description:MOSFET 2N-CH 1200V 58A 9SMPD
  • Series:-

SKU:0e33485faff1 Category: Brand:

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MCB40P1200LB-TRR is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists IXYS. Its product description is MOSFET 2N-CH 1200V 58A 9SMPD. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for MCB40P1200LB-TRR

  • Description:MOSFET 2N-CH 1200V 58A 9SMPD
  • Series:-
  • Mfr:IXYS
  • Package:Tape & Reel (TR)
  • Technology:Silicon Carbide (SiC)
  • Configuration:2 N-Channel (Dual)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):1200V (1.2kV)
  • Current - Continuous Drain (Id) @ 25°C:58A
  • Rds On (Max) @ Id, Vgs:-
  • Vgs(th) (Max) @ Id:-
  • Gate Charge (Qg) (Max) @ Vgs:-
  • Input Capacitance (Ciss) (Max) @ Vds:-
  • Power - Max:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:9-PowerSMD
  • Supplier Device Package:9-SMPD-B
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for MCB40P1200LB-TRR

MCB40P1200LB-TRR

FET, MOSFET Arrays Overview

The MCB40P1200LB-TRR is a Silicon Carbide (SiC) MOSFET module manufactured by IXYS. It features a phase-leg configuration within an SMPD-B package. The device supports a maximum collector-emitter voltage of 1200V and delivers a continuous collector current of 40A at 25°C. Key electrical parameters include a gate-emitter leakage current of 500nA, power dissipation of 150W, and an operating temperature range from -55°C to +150°C.

FET, MOSFET Arrays Feature Summary

  • Utilizes Silicon Carbide technology for high-efficiency power switching
  • Integrates a dual phase-leg configuration in a compact surface-mount package
  • Designed for high-temperature operation up to 150°C

FET, MOSFET Arrays Applications

  • Industrial motor drives
  • Uninterruptible Power Supply (UPS) systems
  • Solar inverters

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix against official datasheets to confirm reel packaging versus tube variants. Ensure compatibility with SMPD-B footprint requirements during PCB layout. Cross-reference thermal resistance values with system heat sink capabilities to maintain safe junction temperatures under load conditions.

FET, MOSFET Arrays Selection Notes

Select this component for applications requiring robust high-voltage handling and low conduction losses. Compare on-resistance metrics against alternative SiC modules to optimize efficiency. Evaluate thermal management solutions suitable for the specified package type to ensure reliable performance across the operational temperature range.

FET, MOSFET Arrays Part Context

This part belongs to IXYS' portfolio of wide-bandgap semiconductor devices. It represents the transition towards higher density power electronics using advanced packaging technologies. The SMPD-B form factor allows for automated surface-mount assembly, facilitating integration into modern compact power conversion architectures.

FET, MOSFET Arrays Replacement Considerations

Consult official substitution guides for direct pin-compatible alternatives. Verify that any replacement maintains identical voltage ratings, current capacities, and thermal characteristics to ensure circuit integrity without redesign.

MCB40P1200LB-TRRMCB40P1200LB-TRR

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