MIXA30W1200TED

Overview

The MIXA30W1200TED is a silicon-based IGBT module manufactured by IXYS, belonging to the MIXA30W1200 series with XPT technology. It features a six-pack configuration housed in an E2-Pack screw-mount package. The device supports a maximum collector-emitter voltage of 1.2 kV and delivers a continuous collector current of 43 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.8 V, a gate-emitter leakage current of 500 nA, and a power dissipation rating of 150 W. The unit operates within a temperature range of -40°C to +125°C and has a maximum gate-emitter voltage of 20 V.

Feature Summary

• Utilizes IXYS XPT (eXtended Plateau Technology) for optimized switching performance.
• Integrates six independent IGBTs into a single compact module structure.
• Designed for robust thermal management via direct screw mounting.

Applications

• Three-phase inverter circuits
• Industrial motor drives
• Uninterruptible power supply systems

Procurement Notes

Verify component authenticity through authorized IXYS distributors or certified suppliers. Confirm RoHS compliance status and REACH SVHC declarations prior to integration. Ensure packaging integrity matches bulk specifications to prevent terminal damage during handling and storage.

Selection Notes

Select this model when a six-pack topology is required for 1.2 kV applications. The 43 A continuous current rating suits moderate power density designs. Verify that the E2-Pack footprint aligns with existing heatsink and PCB constraints compared to alternative configurations.

Part Context

This component is part of the IXYS MIXA series, which utilizes XPT technology to enhance ruggedness and switching efficiency. The MIXA30W1200TED specifically addresses needs for multi-leg inverter topologies where space-saving integration of multiple switches is critical for industrial power electronics.

Replacement Considerations

Direct substitutes include MIXA30W1200TML, which shares identical electrical ratings but utilizes an E1-Pack package. Designers must verify mechanical compatibility and pinout alignment before swapping between these variants.