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The MIXG330PF1200TSF is an N-channel IGBT phase leg module manufactured by IXYS. It features a SimBus F packaging style designed for PCB installation. The device supports a maximum collector-emitter voltage (VCEO) of 1200 V and a continuous collector current (Ic) of 330 A. Key electrical parameters include a maximum collector-emitter saturation voltage (VceSAT) of 1.8 V, a maximum power dissipation (Pd) of 1.5 kW, and a gate-emitter voltage rating of ±20 V. The module operates within a temperature range of -40°C to +150°C.
Verify the specific suffix 'TSF' against official datasheets to confirm the SimBus F package variant. Ensure thermal management solutions align with the 1.5 kW dissipation rating at the intended operating temperature. Cross-reference pinout diagrams with the target PCB layout to prevent installation errors during assembly.
Select this component when high current handling and robust voltage ratings are required in a space-constrained PCB-mounted form factor. Compare the 1.8 V saturation voltage against alternative modules to evaluate efficiency gains in high-power density designs. Confirm that the driving circuitry can support the specified gate voltage limits safely.
This module belongs to the IXYS MIXA/MIXG series of high-power IGBT components. These devices are engineered for industrial applications demanding reliability under heavy electrical loads. The series utilizes advanced silicon planar technology to balance switching speed and conduction efficiency.
Direct substitutes require matching the 1200 V rating, 330 A current capacity, and SimBus F footprint. Verify thermal resistance characteristics and pin compatibility before swapping with other manufacturers' phase leg modules.
The maximum operating temperature is 150°C.
Yes, the MIXG330PF1200TSF utilizes IXYS XPT technology for improved performance.