SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MRF175GV is an N-channel enhancement mode RF MOSFET transistor designed for broadband commercial and military applications. It operates at frequencies up to 500 MHz with a 28 V supply voltage. The device delivers 200 W of output power, achieving a typical power gain of 14 dB and efficiency of 65% at 225 MHz. It features low thermal resistance and a reverse transfer capacitance (Crss) of 20 pF typ at VDS = 28 V.
Verify the specific suffix 'V' against official documentation to confirm performance parameters, as datasheets may define distinct electrical characteristics for different suffixes. Ensure compatibility with required operating frequencies and power levels before procurement. Confirm package style and mounting requirements match system design constraints.
Select this component for HF, VHF, and UHF power amplifier applications requiring high gain and simple bias systems. Consider its relative immunity from thermal runaway and ability to withstand severely mismatched loads. Evaluate gate protection needs, as the device lacks internal monolithic zener diodes and requires external components for transient damping.
The MRF175G series consists of RF power N-channel enhancement mode field-effect transistors featuring a vertical structure with a planar design. These devices are optimized for linear amplification and offer power output control via DC gate voltage variation, facilitating AGC/ALC and modulation system designs.
Consult official MACOM documentation for confirmed substitute part numbers. Verify that any replacement maintains equivalent power, gain, and frequency specifications.
No, these devices do not have an internal monolithic zener diode from gate-to-source. External zener diodes are recommended if gate protection is required.
As an enhancement mode FET, it does not conduct when only drain voltage is applied. A positive voltage slightly exceeding the gate-to-source threshold voltage must be applied to the gate to allow current flow.
Devices should be transported in antistatic bags or conductive foam. Handling should avoid touching leads, and soldering must be performed with grounded equipment to prevent damage.