RF Diode MS8150-P2613 product image

MS8150-P2613

  • Description:RF DIODE SCHOTTKY 3V CHIP
  • Series:-

SKU:c3bee755220f Category: Brand:

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MS8150-P2613 is listed in the RF Diode range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is RF DIODE SCHOTTKY 3V CHIP. Review the specifications below when checking this part for your BOM.

RF Diode specifications for MS8150-P2613

  • Description:RF DIODE SCHOTTKY 3V CHIP
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Diode Type:Schottky - Single
  • Voltage - Peak Reverse (Max):3V
  • Current - Max:15 mA
  • Capacitance @ Vr, F:-
  • Resistance @ If, F:-
  • Power Dissipation (Max):-
  • Operating Temperature:-55°C ~ 125°C
  • Package / Case:Die
  • Supplier Device Package:Chip
  • Grade:-
  • Qualification:-

RF Diode datasheet and documents for MS8150-P2613

MS8150-P2613

RF Diode Overview

The MS8150-P2613 is a Gallium Arsenide (GaAs) flip chip Schottky diode designed for mixer and detector applications at microwave and millimeter wave frequencies. It features a compact footprint of 26 x 13 mils with a thickness of 5 mils and large 5 x 8 mil bond pads. The device operates within a temperature range of -55°C to +125°C. Key electrical specifications include a typical series resistance of 3 Ω, a maximum capacitance of 80 fF at 0 V bias, and a cut-off frequency exceeding 500 GHz. Maximum ratings specify an incident power of +20 dBm, a forward current of 15 mA, and a reverse voltage of 3 V.

RF Diode Feature Summary

  • High-speed operation enabled by a cut-off frequency greater than 500 GHz
  • Low series resistance for efficient signal detection and mixing
  • Robust construction utilizing silicon nitride protective coatings
  • Large gold bond pads facilitating ease of insertion

RF Diode Applications

  • Microwave transceivers
  • Digital radios
  • Automotive radar detectors

RF Diode Procurement Notes

Verify the component origin as Microsemi, now part of Microchip Technology, when sourcing. Confirm that the RoHS compliant gold finish matches project requirements. Ensure handling procedures strictly adhere to Electrostatic Discharge (ESD) precautions due to the sensitivity of the GaAs material. Validate the specific P2613 suffix against the datasheet to ensure correct dimensional and electrical characteristics.

RF Diode Selection Notes

Select this component for designs requiring high-frequency performance up to 100 GHz. The low series resistance and small capacitance make it suitable for sensitive detection circuits. Consider the flip chip package constraints during PCB layout, specifically the 26 x 13 mil size and 5 x 8 mil bond pad dimensions. Ensure the operating environment stays within the specified -55°C to +125°C range.

RF Diode Part Context

This device belongs to the MS8150 series of GaAs Schottky devices. The series utilizes specialized material processing and high-temperature metallization techniques. These components are engineered for high-volume commercial and industrial applications where consistent microwave performance is critical.

RF Diode Replacement Considerations

No official substitute part numbers are documented in the provided datasheet. When evaluating alternatives, match the GaAs technology, flip chip form factor, and electrical parameters such as series resistance and cut-off frequency. Verify that any replacement supports the required operating temperature range and includes similar ESD sensitivity warnings.

RF Diode FAQ

What is the maximum operating temperature for the MS8150-P2613?

The maximum operating junction temperature is +125°C.

How does the device handle electrostatic discharge?

The device is ESD sensitive and must be handled using appropriate ESD precautions to prevent damage.

What is the typical series resistance value?

The typical series resistance is 3 Ω.

MS8150-P2613MS8150-P2613

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