MSC1175M

Overview

The MSC1175M is an NPN bipolar RF transistor designed for high-power applications. It operates within a frequency range of 1.025 GHz to 1.15 GHz, delivering a continuous wave output power of 400 W. The device features a collector-emitter voltage rating of 65 V and supports a maximum collector current of 12 A. Constructed with a chassis mount M218 package, it utilizes a metallurgically bonded die attach for enhanced thermal performance. This component is suitable for demanding radio frequency environments requiring robust power handling capabilities.

Feature Summary

• High-power RF capability with 400 W output in the L-band frequency range
• Robust NPN bipolar construction optimized for linear and switching operations
• Chassis mount M218 package design facilitating efficient heat dissipation
• Metallurgically bonded internal structure for improved reliability under thermal stress

Applications

• Military radar transmitter modules
• Avionics communication systems
• High-power industrial RF heating equipment

Procurement Notes

Verify the specific suffix designation against official Microsemi documentation to confirm exact electrical tolerances and qualification levels. Ensure that the M218 chassis mount interface matches the mechanical constraints of the target assembly. Request manufacturer test reports or traceability certificates to validate authenticity and performance consistency for critical deployment scenarios.

Selection Notes

Evaluate the thermal resistance characteristics of the M218 package against the system's cooling infrastructure requirements. Confirm that the 65 V breakdown voltage provides adequate margin for the intended circuit topology. Assess the 12 A current capacity relative to peak load conditions to prevent device overstress during transient events or fault states.

Part Context

This component belongs to the family of high-power microwave transistors manufactured by Microsemi Corporation. These devices are engineered for specialized defense and aerospace sectors where reliability under extreme environmental conditions is paramount. The M218 form factor distinguishes it from surface-mount alternatives, catering to applications requiring direct chassis integration for superior thermal management.

Replacement Considerations

The MSC1175ME3 is documented as a related variant within the same product line. Verify pinout compatibility and thermal interface specifications before substitution. Cross-reference datasheet parameters to ensure equivalent performance in the target application environment.