MSCSM120AM16CT1AG

FET, MOSFET Arrays Overview

The MSCSM120AM16CT1AG is a Silicon Carbide (SiC) MOSFET power module manufactured by Microchip Technology. It utilizes the SP1F package and features an N-Channel configuration with screw mount installation. The device supports a drain-source breakdown voltage of 1.2 kV and delivers a continuous drain current of 173 A. Its on-resistance is specified at 16 mOhms, with a gate-source voltage range of -10 V to +23 V. The module operates within a temperature range of -40°C to +175°C and handles a power dissipation of 745 W.

FET, MOSFET Arrays Feature Summary

• Utilizes Silicon Carbide technology for high-temperature operation up to 175°C
• Integrates dual N-Channel MOSFETs in a single phase leg configuration
• Features low on-resistance for efficient power switching
• Designed for robust screw mount mechanical attachment

FET, MOSFET Arrays Applications

• High-frequency power conversion systems
• Industrial motor drives
• Uninterruptible power supplies
• Renewable energy inverters

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix 'T1AG' against official Microchip documentation to confirm exact manufacturing lot attributes and compliance status. Ensure compatibility with SP1F mounting hardware. Confirm availability through authorized distributors as supply levels fluctuate. Validate thermal interface material requirements for the target application environment before procurement.

FET, MOSFET Arrays Selection Notes

Select this component when a 1.2 kV SiC phase leg is required with a 16 mOhm on-resistance target. The SP1F package suits applications needing screw-mount reliability. Compare the 173 A current rating against peak load demands. Consider the 175°C junction temperature capability for high-efficiency designs requiring reduced cooling infrastructure compared to silicon alternatives.

FET, MOSFET Arrays Part Context

This part belongs to the Microchip MSCSM120 series of Silicon Carbide MOSFET modules. It shares the 1.2 kV voltage class with other variants like the MSCSM120AM50CT1AG but offers lower on-resistance. The SP1F packaging standardizes mechanical integration across multiple current ratings within the product family.

FET, MOSFET Arrays Replacement Considerations

Direct substitutes include MSCSM120AM50CT1AG for higher resistance/lower current needs or MSCSM120HM31CT3AG for full bridge configurations. Verify pinout and thermal pad dimensions match the existing PCB layout when cross-referencing.