MSCSM70TAM19CT3AG

FET, MOSFET Arrays Overview

The MSCSM70TAM19CT3AG is a triple phase leg Silicon Carbide (SiC) MOSFET power module manufactured by Microchip Technology. It utilizes an SP3F package with screw mount installation for chassis mounting. The device features N-channel transistors with a drain-source breakdown voltage of 700 V and a continuous drain current of 124 A at case temperature. The typical on-resistance is 19 mOhms, supporting a power dissipation of 365 W. Operating temperatures range from -40 C to +175 C, with gate-source voltages specified between -10 V and +23 V.

FET, MOSFET Arrays Feature Summary

• Triple phase leg configuration integrating SiC MOSFETs and diodes in a single module
• SP3F package design utilizing Si3N4 substrate with thick copper for enhanced thermal performance
• Extremely low inductance architecture optimized for high-frequency switching applications

FET, MOSFET Arrays Applications

• Industrial motor drives and inverters
• Uninterruptible power supply systems
• High-efficiency AC/DC and DC/DC converters

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix CT3AG against official Microchip documentation to confirm pinout compatibility and thermal interface requirements. Ensure that the SP3F package dimensions match the target heatsink or PCB layout constraints. Confirm that the operating voltage and current ratings align with the system's peak load conditions to prevent overstress during transient events.

FET, MOSFET Arrays Selection Notes

Select this component for applications requiring high-temperature operation up to 175 C and superior thermal conductivity compared to silicon alternatives. The triple phase leg configuration reduces board space and simplifies assembly for three-phase topologies. Evaluate the 19 mOhms on-resistance against system efficiency targets and ensure adequate gate drive capabilities for the specified voltage limits.

FET, MOSFET Arrays Part Context

This module belongs to the Microchip SiC power module family, designed for robust performance in demanding power electronics environments. The SP3F packaging standardizes mechanical integration across various voltage and current ratings within the product line. It serves as a critical power switching element in modern energy conversion systems requiring high reliability and thermal stability.

FET, MOSFET Arrays Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify cross-compatibility with other SP3F packaged modules from the same manufacturer series before substitution.