FET, MOSFET Arrays MSCSM70TLM07CAG product image

MSCSM70TLM07CAG

$630.64
  • Description:MOSFET 4N-CH 700V 349A SP6C
  • Series:-

SKU:d819b7ddece3 Category: Brand:

  
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MSCSM70TLM07CAG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 4N-CH 700V 349A SP6C. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for MSCSM70TLM07CAG

  • Description:MOSFET 4N-CH 700V 349A SP6C
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • Technology:Silicon Carbide (SiC)
  • Configuration:4 N-Channel (Three Level Inverter)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):700V
  • Current - Continuous Drain (Id) @ 25°C:349A (Tc)
  • Rds On (Max) @ Id, Vgs:6.4mOhm @ 120A, 20V
  • Vgs(th) (Max) @ Id:2.4V @ 12mA
  • Gate Charge (Qg) (Max) @ Vgs:645nC @ 20V
  • Input Capacitance (Ciss) (Max) @ Vds:13500pF @ 700V
  • Power - Max:966W (Tc)
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:SP6C
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for MSCSM70TLM07CAG

MSCSM70TLM07CAG

FET, MOSFET Arrays Overview

The MSCSM70TLM07CAG is a silicon carbide (SiC) MOSFET module manufactured by Microchip Technology. It features a 700V drain-source voltage and an on-resistance of 5 mOhms. The device utilizes the SP6C package configuration with screw mount installation. Key electrical parameters include a continuous drain current of 353A, power dissipation of 966W at case temperature, gate charge of 645nC at 20V, and operating temperatures ranging from -40°C to +175°C.

FET, MOSFET Arrays Feature Summary

  • Utilizes Silicon Carbide technology for superior thermal performance and high-temperature operation up to 175°C.
  • Integrates four N-channel MOSFETs in a compact SP6C package designed for efficient heat dissipation.
  • Features low on-resistance to minimize conduction losses in high-power switching applications.

FET, MOSFET Arrays Applications

  • Three-level inverter systems
  • High-efficiency motor drives
  • Industrial power conversion

FET, MOSFET Arrays Procurement Notes

Verify the specific datasheet revision and ordering suffix to ensure compatibility with your design requirements. Confirm that the SP6C package dimensions match your mechanical constraints. Check for any recent product change notifications regarding pinout or thermal characteristics before finalizing procurement.

FET, MOSFET Arrays Selection Notes

Select this component when designing circuits requiring high voltage blocking capability combined with low conduction losses. The SP6C package is suitable for applications needing robust thermal management. Ensure gate drive voltages align with the specified limits to prevent device damage during operation.

FET, MOSFET Arrays Part Context

This module belongs to Microchip's PM-MOSFET-SIC-SBD series, specifically tailored for advanced power electronics. It represents a discrete semiconductor solution integrating SiC MOSFETs and Schottky diodes. The SP6C form factor allows for direct mounting on cold plates, facilitating integration into modern high-density power converters.

FET, MOSFET Arrays Replacement Considerations

Consult official substitution lists for verified alternatives. Cross-reference electrical parameters such as Vds, Rds(on), and package type to ensure functional equivalence without compromising system reliability or thermal performance.

MSCSM70TLM07CAGMSCSM70TLM07CAG
$630.64
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