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MSCSM70TLM19C3AG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 4N-CH 700V 124A SP3F. Review the specifications below when checking this part for your BOM.
The MSCSM70TLM19C3AG is a silicon carbide (SiC) MOSFET module from Microchip Technology, housed in an SP3F package with chassis mount installation. It features N-channel configuration with a drain-source breakdown voltage of 700 V and a continuous drain current of 124 A at case temperature. The on-resistance is 19 mOhms, supporting a power dissipation of 365 W. Operating temperatures range from -40°C to +175°C, with gate-source voltages between -10 V and +23 V.
Verify the specific suffix C3AG against official Microchip documentation to confirm pinout compatibility and thermal interface requirements. Ensure that the sourcing channel provides valid RoHS compliance certificates. Cross-reference the datasheet revision date to guarantee alignment with current manufacturing specifications before finalizing procurement orders.
Select this component when high efficiency and thermal stability are critical for three-phase systems. The 700V rating suits medium-voltage industrial applications. Evaluate the 19mOhm resistance against system loss budgets. Confirm that the chassis mount style fits the mechanical design constraints of the target enclosure or heat sink assembly.
This module belongs to the MSCSM70 series of SiC power modules. It complements other variants like the MSCSM70TAM19T3AG by offering specific packaging and terminal configurations. The series targets high-performance power electronics requiring superior thermal handling compared to traditional silicon devices.
Direct substitutes include the MSCSM70TAM19T3AG within the same product family. Verify electrical equivalence and mechanical footprint compatibility before swapping components to ensure proper integration into existing designs.
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