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The GeneSiC Semiconductor MUR20040CT is a silicon super fast recovery diode module housed in a Twin Tower package. It features a repetitive peak reverse voltage of 400 V and an average forward current rating of 200 A per package. The device supports a peak forward surge current of 2000 A per leg with a maximum reverse recovery time of 90 ns. Operating temperatures range from -55 °C to +150 °C, and the junction-to-case thermal resistance is 0.45 °C/W.
Verify the specific part number suffix against official documentation before procurement. Confirm that the component matches the required voltage and current ratings for the intended application. Ensure compatibility with the Twin Tower mounting style and verify thermal management requirements align with the specified junction-to-case thermal resistance values.
Select this component for applications requiring high average forward current and fast switching characteristics. Consider the Twin Tower package for mechanical stability and thermal performance. Evaluate the 400 V reverse voltage rating against circuit peak reverse voltages to ensure adequate safety margins during operation.
This component belongs to the MUR200 series of silicon super fast recovery diodes manufactured by GeneSiC Semiconductor. The series includes variants with different voltage ratings, such as the MUR20060CT. These modules are designed for high-power applications requiring reliable rectification and fast recovery times.
Consult official datasheets for cross-reference information. Verify electrical parameters and package dimensions match before substitution.