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The GeneSiC Semiconductor MUR40040CTR is a silicon super fast recovery diode module housed in a Twin Tower package. It features a repetitive peak reverse voltage of 400 V and an average forward current rating of 400 A per package. The device supports a peak forward surge current of 3300 A per leg under specified conditions. Electrical characteristics include a maximum instantaneous forward voltage of 1.3 V, a maximum reverse recovery time of 180 ns, and a maximum thermal resistance from junction to case of 0.35 °C/W per leg. The operating temperature range extends from -55 °C to +150 °C.
Verify the specific part number suffix against official documentation to confirm terminal configuration details. Confirm availability status as discontinuation notices may apply to this product line. Ensure compatibility with existing thermal management solutions given the specified thermal resistance values. Validate that the required voltage and current ratings align with the system design specifications before procurement.
Select this component for applications requiring high current handling and fast switching speeds. The Twin Tower package facilitates screw mounting, which is suitable for industrial environments. Consider the thermal resistance when designing heat sinks to maintain junction temperatures within the specified operating range. Compare the reverse recovery time against system requirements to ensure minimal switching losses.
This module belongs to the MUR400 series of silicon super fast recovery diodes. The series includes variants with different voltage ratings, such as 600 V options. The 'CTR' designation typically indicates a specific terminal configuration or lead arrangement compared to standard versions. These modules are designed for high-power applications where reliability and surge capability are critical.
Consult official datasheets for direct substitutes within the MUR400 series or equivalent products from other manufacturers. Verify that replacement parts match the 400 V reverse voltage and 400 A current ratings. Ensure the alternative device has compatible thermal resistance and package dimensions for seamless integration.