MWI60-06G6K

MWI60-06G6K

  • Description:IGBT MODULE 600V 60A 180W E1
  • Series:-

SKU:78d05240e9b8 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MODULE 600V 60A 180W E1
  • Series:-
  • Mfr:IXYS
  • Package:Box
  • IGBT Type:-
  • Configuration:Three Phase Inverter
  • Vce(on) (Max) @ Vge, Ic:2.8V @ 15V, 30A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 125°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:E1
  • Supplier Device Package:E1
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):60 A
  • Power - Max:180 W
  • Current - Collector Cutoff (Max):200 µA
  • Input Capacitance (Cies) @ Vce:2.5 nF @ 25 V

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MWI60-06G6K

Overview

The MWI60-06G6K is a six-pack IGBT module integrating three N-channel Insulated Gate Bipolar Transistors and three complementary HiPerFRED diodes. It features a low saturation voltage of 2.3 V at 30 A and fast switching characteristics with short tail current. The unit includes an isolated copper base plate for thermal management and solderable pins for printed circuit board mounting. Electrical ratings include a collector-emitter breakdown voltage of 600 V, a continuous collector current of 60 A at 25°C, and a maximum junction temperature of 150°C.

Feature Summary

  • Integrates three IGBTs and three free-wheeling diodes in a single package
  • Features HiPerFRED technology for fast reverse recovery and low leakage current
  • Includes an integrated NTC temperature sensor for thermal monitoring
  • Utilizes an industry-standard package with an isolated copper base plate

Applications

  • AC drives
  • Resonant circuits
  • Industrial motor control systems

Procurement Notes

Verify the specific G6K ordering suffix against the manufacturer's latest documentation to confirm pinout compatibility and terminal configuration. Ensure that the required mounting torque of 2.0 to 2.2 Nm is achievable within the target assembly design. Confirm that the isolation voltage rating of 2500 Vrms meets the safety requirements of the intended electrical environment.

Selection Notes

Select this component when a compact solution requiring three-phase bridge configurations is necessary. The device is suitable for applications operating between 10 kHz and 40 kHz due to its optimized switching speed. Consider the thermal resistance values when designing heat sinks to maintain the junction temperature below the 150°C maximum limit under full load conditions.

Part Context

This module belongs to the MWI series from IXYS, designed for medium-power industrial applications. The six-pack topology consolidates multiple discrete components into a unified semiconductor assembly. This integration reduces parasitic inductance and simplifies the overall system layout compared to using individual transistors.

Replacement Considerations

Direct substitutes require matching the six-pack topology, 600V rating, and similar current capabilities. Verify that any alternative component maintains compatible pin assignments and thermal resistance specifications to ensure seamless integration without redesigning the cooling infrastructure.

MWI60-06G6KMWI60-06G6K

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