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NDS9958 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET N/P-CH 20V 3.5A 8SOIC. Review the specifications below when checking this part for your BOM.
The NDS9958 is a dual-channel enhancement mode field effect transistor containing one N-Channel and one P-Channel MOSFET in an SOIC-8 package. It features a Drain-Source Voltage (VDSS) of ±20V and a continuous Drain Current (ID) of ±3.5A at 25°C. The static Drain-Source On-Resistance (RDS(ON)) is typically 0.1Ω for both channels at VGS = ±10V and ID = ±3.5A. Total Gate Charge (Qg) is typically 30nC. Power Dissipation is rated at 2W for dual operation and up to 1.6W for single operation on large pads. Operating temperature ranges from -55°C to 150°C.
Verify the manufacturer origin, as the component was originally produced by Fairchild Semiconductor. Confirm current availability status through authorized distributors, as production may have transitioned or discontinued. Ensure the specific package variant matches the required PCB footprint and thermal dissipation needs.
Select this component for low voltage applications requiring complementary N-P channel pairs in a compact form factor. Evaluate thermal resistance requirements based on the specific copper pad area used on the PCB, as junction-to-ambient resistance varies significantly with board layout dimensions.
This device belongs to the family of dual MOSFETs designed for portable electronics. It utilizes DMOS technology to minimize on-state resistance while providing robust transient handling capabilities suitable for battery-operated environments where space and efficiency are critical constraints.
Check for direct equivalents such as the FDS8958A which offers similar dual N-P channel functionality. Verify pinout compatibility and ensure that replacement parts meet the same voltage and current ratings for the intended application.
The typical Drain-Source On-Resistance is 0.1Ω for both the N-Channel and P-Channel when tested at VGS = ±10V and ID = ±3.5A.
Junction-to-Ambient thermal resistance (RθJA) varies from 78°C/W on a 0.5 in² pad to 135°C/W on a 0.003 in² pad, depending on the copper area and thickness used for mounting.
The datasheet does not specify AEC-Q101 certification or automotive-grade qualification for this part number; it is primarily described for notebook and cellular phone applications.
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