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NTHL023N065M3S is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is SIC MOS TO247-3L 23MOHM 650V M3S. Review the specifications below when checking this part for your BOM.
The NTHL023N065M3S is an EliteSiC silicon carbide MOSFET in a TO-247-3L package. It features a 650 V drain-source voltage and a typical on-resistance of 23 mΩ at VGS = 18 V. The device supports a continuous drain current of 70 A at 25°C case temperature, with a maximum rating of 218 A pulsed. Key electrical parameters include a total gate charge of 69 nC, output capacitance of 153 pF, and a junction-to-case thermal resistance of 0.57 °C/W. Operating temperatures range from -55°C to +175°C.
Verify the specific ordering suffix against official documentation to confirm package type and shipping configuration. Ensure compatibility with TO-247-3L mounting requirements. Confirm that application conditions remain within the specified maximum ratings for voltage, current, and thermal limits to maintain device reliability and performance integrity.
Select this component for high-efficiency power conversion applications requiring low conduction losses and fast switching speeds. The low thermal resistance facilitates effective heat dissipation in compact designs. Evaluate system requirements against the 650 V breakdown voltage and 70 A continuous current capabilities to ensure adequate headroom for operational stresses.
This part belongs to onsemi's EliteSiC M3S series of silicon carbide MOSFETs. The series is designed for high-voltage, high-frequency power electronics. The NTHL023N065M3S specifically utilizes the TO-247-3L through-hole package, offering robust mechanical stability and thermal performance compared to surface-mount alternatives in the same family.
Consult official substitution guides for verified equivalents. Cross-referencing requires matching voltage ratings, on-resistance values, and package dimensions. Verify that any substitute maintains comparable switching characteristics and thermal resistance to ensure system performance consistency.
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