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The NVH820S75L4SPC is a single-side direct cooling 6-pack power module from the VE-Trac/C0116 Direct family, designed for hybrid and electric vehicle traction inverters. It integrates six Field Stop 4 (FS4) 750 V Narrow Mesa IGBTs with fast recovery diodes in an SSDC33 package. The module supports a continuous DC collector current of 600 A at 175°C junction temperature and handles pulsed currents up to 1640 A. Key electrical parameters include a maximum blocking voltage of 750 V, isolation voltage of 4200 V DC, and stray inductance of 8 nH. Thermal performance features a junction-to-fluid thermal resistance of 0.11°C/W for the IGBT and 0.185°C/W for the diode under specified cooling conditions.
Verify the specific ordering suffix SPC corresponds to the required shipping configuration, which indicates four units per tray. Confirm that the SSDC33 package dimensions align with the mechanical case outline specifications before finalizing procurement. Ensure compliance with RoHS standards and lead-free requirements as stated in the datasheet.
Select this module when designing systems requiring high current density and low switching losses in automotive traction applications. Consider the 175°C continuous operation capability and the specific thermal resistance values for heatsink selection. Evaluate the 8 nH stray inductance impact on circuit layout and gate drive requirements to ensure optimal system efficiency and reliability.
This component belongs to the VE-Trac/C0116 Direct Module series by onsemi, targeting next-generation electric and hybrid vehicle powertrains. It utilizes advanced FS4 IGBT technology to balance high blocking voltage with low conduction and switching losses. The module is part of a broader portfolio of highly integrated power solutions designed to improve overall system efficiency in demanding automotive environments.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing cooling interfaces and pin configurations if considering alternative modules within the same or similar product families.
The module supports continuous operation at a maximum junction temperature (Tvj max) of 175°C.
Thermal management is achieved through single-side direct cooling using an integrated pin-fin heatsink in the baseplate, with a junction-to-fluid thermal resistance of 0.11°C/W for the IGBT.
The module integrates a new generation of press-fit pins into the signal terminals to enhance assembly ease and reliability.