NXH50M65L4Q1PTG

NXH50M65L4Q1PTG

$41.79
  • Description:6KW H6.5 50A Q1PACK PRESS-FIT PI
  • Series:-

SKU:9adacb9cfa18 Category: Brand:

  
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Product Detailed Parameters

  • Description:6KW H6.5 50A Q1PACK PRESS-FIT PI
  • Series:-
  • Mfr:onsemi
  • Package:Tray
  • IGBT Type:Trench Field Stop
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2.22V @ 15V, 50A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:53-PIM/Q2PACK (93x47)
  • Voltage - Collector Emitter Breakdown (Max):650 V
  • Current - Collector (Ic) (Max):48 A
  • Power - Max:86 W
  • Current - Collector Cutoff (Max):300 µA
  • Input Capacitance (Cies) @ Vce:3.137 nF @ 20 V

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NXH50M65L4Q1PTG

Overview

The NXH50M65L4Q1PTG is a silicon IGBT module from the NXH50M65L4Q1 series manufactured by onsemi. It utilizes Q1PACK technology with press-fit pins and includes an integrated TCP7000 temperature sensor. The device features a full bridge configuration with a maximum collector-emitter voltage of 650 V and a continuous collector current of 48 A at 25°C. The saturation voltage is 1.56 V, with power dissipation rated at 72 W. Operating temperatures range from -40°C to +150°C.

Feature Summary

  • Integrated TCP7000 temperature sensor for thermal monitoring
  • Q1PACK package design with press-fit pin connection
  • Full bridge configuration for power conversion applications

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Induction heating systems

Procurement Notes

Verify component authenticity through authorized onsemi distributors or certified supply chain partners. Confirm that the specific suffix PTG corresponds to the intended packaging and terminal configuration as defined in official documentation. Ensure compliance with RoHS directives and check for any active Product Change Notifications affecting material composition or manufacturing origin before procurement.

Selection Notes

Select this module when a 650V IGBT solution with integrated thermal sensing is required. The press-fit termination method eliminates soldering requirements, enhancing mechanical reliability in high-vibration environments. Verify that the system's thermal management can handle the specified 72W power dissipation and that the gate drive circuitry matches the switching characteristics of the NXH50M65L4Q1 series.

Part Context

This component belongs to the NXH50M65L4Q1 family of IGBT modules. It shares core electrical specifications with variants like NXH50M65L4Q1SG but differs in packaging and terminal implementation. The PTG suffix indicates specific assembly and packaging details distinct from other series members, requiring careful cross-referencing with datasheets to ensure functional compatibility in existing designs.

Replacement Considerations

Direct substitutes include NXH50M65L4Q1SG if press-fit terminals are not strictly required. Verify pinout compatibility and thermal resistance values when replacing with other 650V IGBT modules. Ensure the replacement part supports the same operating temperature range and includes necessary thermal monitoring interfaces.

NXH50M65L4Q1PTGNXH50M65L4Q1PTG
$41.79
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