PCFG75T120SQF

Description：IGBT FIELD STOP 1200V WAFER
Series：-

SKU:59bcefd5cd3d Category: Single IGBTs Brand: onsemi

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Product introduction

Product Detailed Parameters

Description：IGBT FIELD STOP 1200V WAFER
Series：-
Mfr：onsemi
Package：Bulk
IGBT Type：Field Stop
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：-
Current - Collector Pulsed (Icm)：300 A
Vce(on) (Max) @ Vge, Ic：1.95V @ 15V, 40A
Power - Max：-
Switching Energy：-
Input Type：Standard
Gate Charge：399 nC
Td (on/off) @ 25°C：-
Test Condition：-
Reverse Recovery Time (trr)：-
Operating Temperature：-55°C ~ 175°C (TJ)
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Wafer
Grade：-
Qualification：-

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PCFG75T120SQF

Overview

The PCFG75T120SQF is a single Insulated Gate Bipolar Transistor (IGBT) die manufactured by onsemi. It utilizes Field Stop technology and is rated for a maximum collector-emitter breakdown voltage of 1200 V. The component is designed for surface mount wafer applications, providing robust performance in high-power switching environments.

Feature Summary

Field Stop IGBT construction
Single transistor configuration
Surface mount wafer format

Applications

High-power switching circuits
Industrial power electronics
Inverter systems

Procurement Notes

Verify the specific wafer lot and die specifications against the official datasheet before integration. Confirm that the surface mount wafer form factor aligns with the target assembly process. Ensure compatibility with the intended thermal management solution for the bare die application.

Selection Notes

Select this component when a bare die IGBT solution is required for custom packaging or advanced thermal designs. The 1200 V rating suits high-voltage applications. Evaluate the Field Stop technology benefits for efficiency needs compared to standard trench designs.

Part Context

This part belongs to the single IGBT category from onsemi. It represents a discrete semiconductor device utilizing Field Stop architecture. The wafer format distinguishes it from packaged modules, offering flexibility for specialized manufacturing processes.