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PSMN1R0-40SSHJ is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is MOSFET N-CH 40V 325A LFPAK88. Review the specifications below when checking this part for your BOM.
The Nexperia PSMN1R0-40SSHJ is an N-channel enhancement mode MOSFET utilizing NextPowerS3 technology in an LFPAK88 (SOT1235) package. It features a drain-source voltage of 40 V and a continuous drain current capability of 325 A at Tmb = 25 °C. The typical on-state resistance (RDSon) is 0.88 mΩ at VGS = 10 V and ID = 25 A, with a maximum of 1 mΩ. Total gate charge (QG) is typically 98 nC. The device operates within a junction temperature range of -55 °C to +175 °C and has a total power dissipation rating of 375 W.
Verify the specific suffix 'J' against official Nexperia documentation to confirm tape and reel specifications or marking details. Ensure the ordering part number matches the required package variant and compliance standards. Cross-reference the datasheet revision date to confirm the most recent electrical characteristics and thermal data are applied during design validation.
Select this component for designs requiring standard level gate drive compatibility with high current handling capabilities. The LFPAK88 package provides an ideal replacement footprint for D2PAK and 10x12 mm leadless types while offering superior thermal performance. Consider the 175 °C qualification and UL2595 creepage requirements for safety-critical industrial or server power supply environments.
This device belongs to the Nexperia NextPowerS3 portfolio, which integrates Schottky-like switching performance into standard MOSFET structures. The LFPAK88 package is designed for surface mounting with exposed leads for optimal thermal dissipation and visual solder joint inspection. It targets high-efficiency applications operating at high switching frequencies and heavy load currents.
Officially documented as an ideal replacement for D2PAK and 10 x 12 mm leadless package types. Verify pinout compatibility and thermal resistance differences when substituting legacy packages in existing PCB layouts.
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