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The RGSX5TS65HRC11 is a single N-channel Field Stop Trench IGBT manufactured by ROHM Semiconductor, designed for automotive and industrial power applications. It features a TO-247N-3 through-hole package with a maximum collector-emitter voltage (VCEO) of 650 V and a continuous collector current (Ic) of 75 A at 100°C. The device exhibits a typical collector-emitter saturation voltage (VCE(sat)) of 2.15 V and a short-circuit withstand time (tsc) of 8 μs. It is qualified to the AEC-Q101 standard, ensuring reliability in harsh environments. The component supports a maximum power dissipation (Pd) of 404 W and operates within a junction temperature range of -40°C to +175°C.
Verify the specific suffix C11 indicates tube packaging when sourcing. Confirm AEC-Q101 compliance requirements match your design specifications. Check for RoHS and REACH status updates on official manufacturer channels. Ensure lead times align with production schedules as automotive components may have longer availability windows. Validate pinout compatibility with existing PCB footprints before finalizing procurement.
Select this component for designs requiring robust short-circuit immunity in 650 V automotive systems. Compare VCE(sat) values against alternative IGBTs to optimize conduction losses. Consider the 8 μs short-circuit time when designing protection circuits. Evaluate thermal management needs based on the 404 W dissipation rating. Ensure gate drive voltages remain within the ±30 V limit for safe operation.
This part belongs to ROHM's RGS series of automotive-grade IGBTs. The series utilizes Field Stop Trench technology to balance low conduction and switching losses. It is engineered specifically for high-reliability applications in electric vehicles and hybrid electric vehicles. The TO-247N package provides efficient heat dissipation for high-current scenarios.
Direct substitutes include RGSX5TS65HR and RGSX5TS65EHRC11 from the same manufacturer family. Verify electrical parameters such as VCE(sat) and tsc when cross-referencing with other brands. Ensure package dimensions and pin configurations are identical to avoid PCB redesign.