SD241HR2

Diode Arrays Overview

The SD241HR2 is a Schottky barrier rectifier manufactured by Microchip Technology. It features a dual common cathode configuration housed in a TO-3 (TO-204AA) metal can package designed for through-hole mounting. The device supports a repetitive peak reverse voltage of 45 V and a maximum average forward rectified current of 30 A. Key electrical characteristics include low forward voltage drop and reverse energy testing capabilities.

Diode Arrays Feature Summary

• Schottky barrier rectifier technology
• Guard ring protection structure
• Low forward voltage characteristic

Diode Arrays Applications

• High current power supply circuits
• Free-wheeling diode applications
• Reverse polarity protection systems

Diode Arrays Procurement Notes

Verify the specific suffix 'HR2' against official Microchip documentation to confirm exact manufacturing specifications, as generic datasheets may list broader series parameters. Ensure the procurement source provides authentic Microchip Technology components rather than third-party equivalents. Confirm RoHS compliance status directly with the supplier, as some listings indicate non-compliance. Request detailed test reports to validate the 30 A current rating and 45 V reverse voltage endurance under thermal stress conditions.

Diode Arrays Selection Notes

Select this component when high surge current handling and low conduction losses are required in industrial or automotive environments. The TO-3 metal case offers superior thermal dissipation compared to plastic packages, making it suitable for high-power density designs. Evaluate the trade-off between the robust mechanical strength of the metal can and potential PCB space constraints. Consider the common cathode topology for efficient bridge-less or synchronous rectification topologies where bidirectional blocking is not required.

Diode Arrays Part Context

This part belongs to the SD241 series of Schottky barrier rectifiers from Microchip Technology. The series is characterized by its use in high-reliability applications requiring fast switching speeds and minimal reverse recovery charge. The TO-3 package variant distinguishes it from smaller surface-mount or plastic axial counterparts within the same electrical family, providing enhanced ruggedness for harsh operating conditions.

Diode Arrays Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided reference data. Engineers should consult Microchip Technology's official cross-reference guides or authorized distributor databases for verified equivalent components that match the 30 A/45 V Schottky specifications and TO-3 package dimensions.