Diode Arrays SF2007GH product image

SF2007GH

$0.49
  • Description:DIODE ARRAY GP 500V 20A TO-220AB
  • Series:-

SKU:df5290ed89a6 Category: Brand:

  
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SF2007GH is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARRAY GP 500V 20A TO-220AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for SF2007GH

  • Description:DIODE ARRAY GP 500V 20A TO-220AB
  • Series:-
  • Mfr:Taiwan Semiconductor Corporation
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):500 V
  • Current - Average Rectified (Io) (per Diode):20A
  • Voltage - Forward (Vf) (Max) @ If:1.7 V @ 10 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):35 ns
  • Current - Reverse Leakage @ Vr:5 µA @ 500 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Supplier Device Package:TO-220AB
  • Grade:Automotive
  • Qualification:AEC-Q101

Diode Arrays datasheet and documents for SF2007GH

SF2007GH

Diode Arrays Overview

The SF2007GH is a super fast recovery rectifier diode array manufactured by Taiwan Semiconductor Corporation. It features a common cathode configuration with two individual diodes housed in a single TO-220AB package. The device is rated for a continuous forward current of 20A and a repetitive peak reverse voltage of 500V. Key electrical specifications include a maximum non-repetitive peak surge current of 150A and a typical reverse recovery time of 35ns. The component operates within a junction temperature range of -55°C to +150°C, ensuring reliable performance in high-power applications requiring rapid switching capabilities.

Diode Arrays Feature Summary

  • Super fast recovery characteristics enable efficient high-frequency operation
  • Common cathode dual-diode configuration simplifies circuit layout
  • High thermal stability supports robust performance under varying conditions

Diode Arrays Applications

  • High-frequency power supply circuits
  • DC-DC converter output rectification
  • Free-wheeling diode applications in motor drives

Diode Arrays Procurement Notes

Verify the specific ordering suffix matches the required package variant and lead time requirements. Confirm that the manufacturer's standard lead time aligns with project schedules before finalizing orders. Ensure compatibility with existing thermal management solutions due to the TO-220AB package profile. Cross-reference datasheet parameters against application constraints to validate suitability for intended operating temperatures and current loads.

Diode Arrays Selection Notes

Select this component when super fast recovery times are critical for minimizing switching losses in power conversion stages. The 20A current rating suits moderate to high-power designs requiring reliable rectification. Consider the TO-220AB package for straightforward mounting and heat dissipation needs. Evaluate the 500V reverse voltage capability against peak transient voltages present in the target circuit topology to ensure adequate safety margins.

Diode Arrays Part Context

This part belongs to the SF series of super fast recovery rectifiers from Taiwan Semiconductor. It complements other devices in the lineup offering similar current ratings but varying voltage or speed specifications. The series targets applications demanding improved efficiency over standard recovery diodes. Understanding its position within the broader portfolio aids in identifying alternative parts with adjusted electrical characteristics if design requirements evolve.

Diode Arrays Replacement Considerations

Direct substitutes must match the 20A current, 500V voltage, and super fast recovery attributes. Verify pinout compatibility for the common cathode arrangement in the TO-220AB package. Ensure replacement components meet identical thermal and electrical standards to maintain system reliability without redesigning the PCB layout or cooling infrastructure.

SF2007GHSF2007GH
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