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The Vishay Siliconix SI4900DY-T1-E3 is a dual N-channel MOSFET utilizing TrenchFET technology, housed in an SO-8 surface-mount package. It features a drain-source voltage rating of 60 V and a continuous drain current of 5.3 A at a case temperature of 25 °C. The on-state resistance is specified as 0.058 Ω at VGS = 10 V and 0.072 Ω at VGS = 4.5 V. Total gate charge is typically 13 nC at VGS = 10 V. The device supports an operating junction temperature range from -55 °C to 150 °C.
Verify the component against the official Vishay datasheet document number 73272. Confirm that the marking on the physical package matches the SI4900DY identifier. Ensure the ordering suffix corresponds to lead-free specifications. Validate all electrical parameters directly with the manufacturer before finalizing procurement decisions.
Evaluate thermal management requirements based on the maximum junction-to-ambient thermal resistance of 62.5 °C. Consider the specific gate drive voltage levels required to achieve the target on-resistance values. Verify that the application current does not exceed the continuous or pulsed drain current limits under the expected operating temperatures.
This component belongs to the Vishay Siliconix Si4900DY series of dual N-channel MOSFETs. It is manufactured using silicon technology and is designed for surface mounting. The product line utilizes TrenchFET technology to optimize performance characteristics for power switching applications.
The Si4900DY-T1-GE3 is documented as a lead-free and halogen-free alternative within the same series.
The typical total gate charge is 13 nC when tested at VDS = 30 V, VGS = 10 V, and ID = 4.3 A.
The maximum power dissipation is 3.1 W when the case temperature is maintained at 25 °C.
At VDD = 30 V, RL = 8.8 Ω, ID ≈ 3.4 A, VGEN = 4.5 V, and Rg = 1 Ω, the turn-on delay time is 15 ns and the rise time is 65 ns.