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The SIGC11T60SNC is a 600 V NPT technology IGBT chip designed for integration into modules. It features a 100 µm thickness and a die size of 3.25 x 3.25 mm². The device supports a DC collector current of 10 A and a pulsed collector current of 30 A. Key electrical parameters include a saturation voltage of 1.7 V to 2.4 V at 10 A, an input capacitance of 550 pF, and a turn-off delay time of 198 ns. Operating junction temperature ranges from -55 °C to +150 °C.
Verify the specific ordering code Q67050-A4155-A001 against procurement requirements. Confirm that the component is handled as an Electrostatic Discharge Sensitive Device per MIL-STD 883. Ensure storage conditions adhere to the recommendation of dry nitrogen below 23°C for less than six months to maintain integrity.
Select this chip when designing modules requiring 600 V blocking capability with a 10 A continuous current rating. The NPT architecture provides a positive temperature coefficient, facilitating parallel operation without complex current balancing circuits. Verify thermal management capabilities to support the specified operating junction temperature range up to 150 °C.
This component is a bare IGBT chip intended for assembly within larger power electronic modules rather than standalone discrete use. It belongs to Infineon's portfolio of chips utilizing NPT technology, which is engineered for improved ruggedness and switching characteristics compared to older punch-through designs.
Refer to datasheet SGP10N60A for related device information. No direct public substitute part numbers are confirmed in the provided documentation.