SIGC14T60NCX1SA1

Description：IGBT NPT 600V 15A DIE
Series：-

SKU:1861857b6909 Category: Single IGBTs Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT NPT 600V 15A DIE
Series：-
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：NPT
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：15 A
Current - Collector Pulsed (Icm)：45 A
Vce(on) (Max) @ Vge, Ic：2.5V @ 15V, 15A
Power - Max：-
Switching Energy：-
Input Type：Standard
Gate Charge：-
Td (on/off) @ 25°C：21ns/110ns
Test Condition：300V, 15A, 18Ohm, 15V
Reverse Recovery Time (trr)：-
Operating Temperature：-55°C ~ 150°C (TJ)
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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SIGC14T60NCX1SA1

Overview

The SIGC14T60NCX1SA1 is a bare IGBT chip utilizing NPT technology with a 600V collector-emitter voltage rating. It features a 15A DC collector current and a 100µm die thickness. The component operates within a junction temperature range of -55°C to +150°C. Key electrical parameters include a maximum VCE(sat) of 2.5V at 15A, a VGE(th) range of 4.5V to 6.5V, and a zero gate voltage collector current of 1.1µA. Dynamic characteristics specify a turn-off fall time of 25ns under inductive load conditions.

Feature Summary

Utilizes Non-Punch-Through (NPT) technology for robust performance
Features a positive temperature coefficient for safe parallel operation
Designed as a bare die for integration into custom power modules

Applications

Industrial motor drives
Power module assembly
Discrete component manufacturing

Procurement Notes

Verify the specific ordering code Q67050-A4135-A001 against the datasheet to ensure correct revision matching. Confirm that the X1SA1 suffix aligns with your required packaging or tape-and-reel specifications. Ensure storage conditions remain within dry nitrogen and below 23°C to maintain component integrity prior to use.

Selection Notes

Select this component when designing high-voltage IGBT modules requiring 600V blocking capability. The NPT technology provides reliable switching characteristics suitable for industrial drive applications. Consider the 100µm thickness and die size for thermal management and bonding compatibility within your specific module architecture.

Part Context

This part belongs to Infineon's discrete IGBT chip portfolio, specifically engineered for internal use in power modules rather than direct circuit mounting. It serves as a fundamental building block for manufacturers assembling multi-chip power electronics solutions.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Direct replacement requires identical NPT technology specifications and compatible mechanical dimensions.