SIGC14T60SNCX1SA6

Description：IGBT NPT 600V 15A DIE
Series：-

SKU:a1ff3c36c0b9 Category: Single IGBTs Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT NPT 600V 15A DIE
Series：-
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：NPT
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：15 A
Current - Collector Pulsed (Icm)：45 A
Vce(on) (Max) @ Vge, Ic：2.5V @ 15V, 15A
Power - Max：-
Switching Energy：-
Input Type：Standard
Gate Charge：-
Td (on/off) @ 25°C：31ns/261ns
Test Condition：400V, 15A, 21Ohm, 15V
Reverse Recovery Time (trr)：-
Operating Temperature：-55°C ~ 150°C (TJ)
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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SIGC14T60SNCX1SA6

Overview

The SIGC14T60SNC is a bare IGBT chip manufactured by Infineon Technologies using Non-Punch-Through (NPT) technology. It features a collector-emitter voltage rating of 600 V and a DC collector current capability of 15 A at 25°C. The die size measures 3.8 x 3.8 mm² with a thickness of 100 µm. Key electrical parameters include a saturation voltage of 1.6 V to 2.5 V, a threshold voltage of 3 V to 5 V, and an input capacitance of up to 960 pF. The device supports a maximum operating junction temperature of +150 °C.

Feature Summary

Utilizes NPT technology for positive temperature coefficient characteristics
Designed for easy paralleling in high-current applications
Short-circuit proof capability for enhanced robustness

Applications

Industrial motor drives
Power conversion systems requiring discrete IGBT integration

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm physical state. The datasheet distinguishes between sawn-on-foil and unsawn variants. Ensure compatibility with assembly processes such as epoxy or soft solder die bonding. Confirm storage requirements including dry nitrogen environments if applicable.

Selection Notes

Select this component when integrating discrete IGBTs into custom power modules or assemblies. Consider thermal management capabilities as the DC current rating depends on assembly thermal properties. Evaluate switching speed requirements against the specified dynamic characteristics under inductive load conditions.

Part Context

This bare chip serves as the core semiconductor element for the SGP15N60 module. It represents Infineon's implementation of 600V NPT technology optimized for industrial drive applications. The component allows manufacturers to design custom power electronics solutions with tailored packaging and thermal interfaces.