SIGC14T60SNCX7SA2

SIGC14T60SNCX7SA2

  • Description:IGBT NPT 600V 15A DIE
  • Series:-

SKU:aa5533cb9f14 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 15A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):15 A
  • Current - Collector Pulsed (Icm):45 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 15A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:31ns/261ns
  • Test Condition:400V, 15A, 21Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC14T60SNCX7SA2

Overview

The SIGC14T60SNCX7SA2 is a Silicon Carbide (SiC) MOSFET from Infineon's OptiMOS™ portfolio, housed in an SOT-89 surface-mount package. It features a 600 V drain-source voltage rating and supports continuous drain currents up to 0.09 A at 25°C, with peak pulsed current capability of 0.4 A. The device exhibits a maximum on-state resistance of 45,000 mΩ at 10 V gate drive and typical gate charge of 3.9 nC. Key capacitance parameters include Ciss of 99 pF and Coss of 7.6 pF. Thermal performance is defined by a junction-to-ambient thermal resistance of 125 K/W, allowing operation within a -55°C to +150°C temperature range.

Feature Summary

  • Utilizes silicon carbide technology for enhanced high-voltage switching efficiency
  • Designed for small power applications requiring robust thermal management
  • Features low gate charge characteristics for efficient driver interface

Applications

  • Small signal switching circuits
  • Low-power DC-DC converter stages
  • High-voltage protection interfaces

Procurement Notes

Verify the specific suffix 'X7SA2' against official Infineon documentation to confirm exact tape-and-reel or tube packaging configuration, as suffixes often dictate logistics rather than electrical function. Ensure the sourcing channel provides valid traceability data consistent with automotive or industrial quality standards required for SiC components. Cross-reference the latest datasheet revision to confirm parameter stability before finalizing procurement contracts.

Selection Notes

Select this component when system design requires a compact SOT-89 footprint combined with 600 V breakdown capability. The relatively high RDS(on) suggests suitability for low-current control paths rather than main power handling. Evaluate the 125 K/W thermal resistance against available PCB copper area to ensure junction temperatures remain within the 150°C limit under expected load conditions.

Part Context

This part belongs to Infineon's broader portfolio of discrete power semiconductors, specifically targeting the intersection of small-signal logic compatibility and high-voltage isolation. While sharing the OptiMOS branding, this specific SiC variant differs significantly from standard silicon MOSFETs in material properties and switching behavior, offering distinct advantages in high-frequency, low-current high-voltage environments.

Replacement Considerations

Direct pin-compatible replacements must match the 600 V rating and SOT-89 outline. Verify that alternative SiC devices maintain similar gate threshold voltages (1.3 V to 2.3 V) to ensure compatibility with existing low-voltage drive circuits without requiring level-shifting modifications.

SIGC14T60SNCX7SA2SIGC14T60SNCX7SA2

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