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Product Detailed Parameters
- Description：IGBT TRENCH FS 600V 100A DIE
- Series：TrenchStop™
- Mfr：Infineon Technologies
- Package：Bulk
- IGBT Type：Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：100 A
- Current - Collector Pulsed (Icm)：300 A
- Vce(on) (Max) @ Vge, Ic：1.85V @ 15V, 100A
- Power - Max：-
- Switching Energy：-
- Input Type：Standard
- Gate Charge：-
- Td (on/off) @ 25°C：-
- Test Condition：-
- Reverse Recovery Time (trr)：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Grade：-
- Qualification：-
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Overview
The SIGC54T60R3E is a bare die IGBT utilizing TRENCHSTOP™ IGBT3 technology with a 600V collector-emitter voltage rating. It features a 100A DC collector current and a maximum pulsed collector current of 300A. The device operates within a junction temperature range of -40°C to +175°C and supports a short circuit time of 6µs at VGE=15V, VCC=360V, and Tvj=150°C. Key electrical parameters include a typical VCEsat of 1.45V at 100A and VGE, and a typical input capacitance (Cies) of 6160pF. The die dimensions are 5.97mm x 8.97mm.
Feature Summary
- Utilizes 600V trench and field stop technology for optimized performance.
- Features low saturation voltage and low turn-off losses for efficiency.
- Positive temperature coefficient enables easy paralleling in power modules.
Applications
- Industrial drives
- White goods inverters
- Resonant applications
Procurement Notes
Verify the specific ordering suffix against official Infineon documentation to ensure correct configuration. Confirm that the component is supplied as a bare die on foil rather than a packaged module. Ensure storage conditions comply with IEC 62258-3 standards for moisture sensitivity management prior to assembly.
Selection Notes
Select this component when designing power modules or discrete assemblies requiring high current density and robust short-circuit capability. Evaluate thermal management requirements carefully, as switching characteristics depend heavily on the final module design and mounting technology. Verify compatibility with Al wire bonding processes using wires ≤500µm.
Part Context
This component belongs to the TRENCHSTOP™ IGBT3 family from Infineon Technologies. It serves as a semiconductor chip intended for integration into larger power electronic systems. Unlike packaged devices, it requires external packaging and interconnection to function within a circuit.
Replacement Considerations
Direct replacements must match the 600V rating, 100A current class, and identical die dimensions (5.97mm x 8.97mm). Verify that alternative chips support the same TRENCHSTOP™ IGBT3 architecture and compatible pad metal specifications for existing manufacturing lines.
FAQ
Is the SIGC54T60R3E qualified for automotive applications?
No, the product is not qualified according to AEC-Q100 or AEC-Q101 documents of the Automotive Electronics Council.
What is the recommended maximum short circuit duration?
The allowed number of short circuits is limited to one event lasting up to 1 second, though the specified short circuit time parameter is 6µs under defined test conditions.
Can switching characteristics be specified for this bare die?
No, switching characteristics and thermal properties depend strongly on the module design and mounting technology and cannot be specified for the bare die alone.
