SLA5037

Overview

The SLA5037 is a general-purpose N-channel power MOSFET manufactured by Sanken Electric USA Inc. It features a drain-source voltage rating of 100 V and a continuous drain current capacity of ±10 A at 25°C, with a pulsed current capability of ±40 A for pulses up to 1 ms. The device utilizes an SLA (12-pin) package with a fin structure designed for efficient thermal dissipation. Key electrical characteristics include a maximum on-resistance of 95 mΩ at VGS=4V and 60 mΩ at VGS=10V, both measured at ID=5A. The component supports a junction temperature range from -40°C to +150°C and includes an isolation voltage of 1000 Vrms between the fin and lead pins.

Feature Summary

• Integrated heat-dissipating fin structure within the SIP package for improved thermal management
• High-voltage insulation capability between the metal fin and lead pins
• Low on-resistance optimized for high-efficiency switching applications

Applications

• General purpose power switching circuits
• DC-DC converter topologies
• Motor drive output stages

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct pinout and thermal specifications. Confirm that the required gate drive voltage aligns with the specified RDS(ON) conditions for optimal performance. Ensure proper heatsinking or airflow is planned given the thermal resistance parameters provided in the documentation.

Selection Notes

Select this component when a 100 V N-channel MOSFET with integrated thermal fins is required. Evaluate the thermal resistance values based on the expected ambient temperature and whether natural cooling or infinite heatsink conditions apply. Verify that the gate drive signal can achieve the necessary VGS levels to minimize conduction losses effectively.

Part Context

This component belongs to Sanken Electric's SLA series of single in-line packages featuring built-in heat sinks. These modules are designed to simplify thermal management in power electronics by combining the semiconductor die with a conductive structural element. The series typically targets applications requiring robust power handling in compact form factors.

Replacement Considerations

Public confirmed substitute part numbers: None available.