STGB19NC60HDT4

Overview

The STGB19NC60HDT4 is a single N-channel IGBT from the PowerMESH™ series, manufactured by STMicroelectronics. It features a 600 V collector-emitter breakdown voltage and a continuous collector current of 19 A at 25°C case temperature. The device includes an integrated ultra-fast recovery antiparallel diode with a reverse recovery time of 31 ns. Key electrical parameters include a maximum gate-emitter voltage of ±20 V, a typical on-state voltage drop of 2.5 V at 12 A, and a total power dissipation of 130 W in the D2PAK package. Switching characteristics show turn-on energy of 85 µJ and turn-off energy of 189 µJ under standard test conditions.

Feature Summary

• Advanced PowerMESH technology providing an optimized balance between low on-state voltage drop and fast switching performance.
• Integrated ultra-fast recovery antiparallel diode designed for very soft switching characteristics to minimize electromagnetic interference.

Applications

• High-frequency motor control systems
• Switch-mode power supplies (SMPS)
• Power factor correction (PFC) circuits using hard-switched or resonant topologies

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct packaging configuration. Confirm RoHS compliance status and lead times directly with authorized distributors prior to procurement. Ensure thermal management requirements align with the specified junction-to-case thermal resistance values provided in the technical documentation.

Selection Notes

Select this component for applications requiring high-speed switching combined with low conduction losses. The D2PAK surface-mount package facilitates automated assembly. Evaluate thermal constraints carefully, as the continuous current rating decreases significantly at elevated case temperatures compared to the 25°C baseline rating found in the specifications.

Part Context

This part belongs to the STGx19NC60HD family, which includes variants such as STGP19NC60HD and STGW19NC60HD. These devices share identical electrical characteristics but differ primarily in their physical package configurations, including TO-220AB and TO-247 formats, allowing designers to choose based on thermal and mechanical layout requirements.

Replacement Considerations

Direct functional substitutes within the same family include STGP19NC60HD and STGW19NC60HD. Verify pinout compatibility and thermal resistance differences when substituting between package types. Cross-reference absolute maximum ratings to ensure equivalent robustness in the target application environment.