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Product Detailed Parameters
- Description：IGBT 600V 40A 130W D2PAK
- Series：PowerMESH™
- Mfr：STMicroelectronics
- Package：Tape & Reel (TR)
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：40 A
- Current - Collector Pulsed (Icm)：-
- Vce(on) (Max) @ Vge, Ic：2.5V @ 15V, 12A
- Power - Max：130 W
- Switching Energy：81µJ (on), 125µJ (off)
- Input Type：Standard
- Gate Charge：53 nC
- Td (on/off) @ 25°C：25ns/90ns
- Test Condition：390V, 12A, 10Ohm, 15V
- Reverse Recovery Time (trr)：-
- Operating Temperature：-65°C ~ 150°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Supplier Device Package：D2PAK
- Grade：-
- Qualification：-
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Overview
The STGB19NC60WT4 is a 600 V, 19 A ultra-fast IGBT utilizing the PowerMESH™ process for optimized switching and on-state performance. It features a low CRES/CIES ratio to prevent cross-conduction susceptibility. The device is housed in a D2PAK (TO-263) surface-mount package with tape-and-reel packaging. Key electrical parameters include a collector-emitter saturation voltage of 2.5 V max at 12 A, total gate charge of 53 nC, and turn-on/turn-off switching energies of 81 µJ and 125 µJ respectively under standard test conditions.
Feature Summary
- Advanced PowerMESH™ technology ensures an excellent trade-off between switching performance and low on-state behavior.
- Low CRES/CIES ratio eliminates susceptibility to cross-conduction in high-frequency applications.
- Ultra-fast recovery characteristics suitable for hard-switching and resonant topologies.
Applications
- High frequency motor controls
- Inverters and UPS systems
- High frequency SMPS and PFC circuits
Procurement Notes
Verify the specific ordering code against the manufacturer's current documentation to ensure compatibility with the required package type and revision level. Confirm that the D2PAK footprint matches the target PCB design. Check for any recent product change notices regarding lead modification or packaging updates before finalizing procurement plans.
Selection Notes
Select this component for designs requiring high-frequency operation where minimizing cross-conduction risks is critical. The D2PAK package offers a compact solution for surface-mount applications. Ensure thermal management strategies account for the specified junction-to-case thermal resistance values under expected operating temperatures.
Part Context
This part belongs to the STGx19NC60W family, which includes variants in TO-220 and TO-247 packages. The 'W' suffix typically denotes specific package configurations within this series. It shares core electrical characteristics with other members of the 19A 600V class but differs in physical mounting and thermal dissipation capabilities based on the chosen housing.
Replacement Considerations
Direct replacements include STGP19NC60W and STGW19NC60W from the same datasheet family, provided the application can accommodate through-hole mounting. For surface-mount needs, verify if newer revisions like the STGB19NC60HDT4 offer compatible pinouts and improved thermal metrics without altering circuit design constraints.
