STGB30H60DFB

$2.92

Description：IGBT TRENCH FS 600V 60A TO-263
Series：-

SKU:6040e4a94fc4 Category: Single IGBTs Brand: STMicroelectronics

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Product introduction

Product Detailed Parameters

Description：IGBT TRENCH FS 600V 60A TO-263
Series：-
Mfr：STMicroelectronics
Package：Tape & Reel (TR),Cut Tape (CT)
IGBT Type：Trench Field Stop
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：60 A
Current - Collector Pulsed (Icm)：120 A
Vce(on) (Max) @ Vge, Ic：2V @ 15V, 30A
Power - Max：260 W
Switching Energy：383µJ (on), 293µJ (off)
Input Type：Standard
Gate Charge：149 nC
Td (on/off) @ 25°C：37ns/146ns
Test Condition：400V, 30A, 10Ohm, 15V
Reverse Recovery Time (trr)：53 ns
Operating Temperature：-55°C ~ 175°C (TJ)
Mounting Type：Surface Mount
Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Supplier Device Package：TO-263 (D2PAK)
Grade：-
Qualification：-

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STGB30H60DFB

Overview

The STGB30H60DFB is a single IGBT from the HB series, utilizing trench gate field-stop technology. It features a 600 V collector-emitter voltage and a continuous collector current of 30 A at 25°C, with a peak rating of 60 A. The saturation voltage is typically 1.55 V at 30 A. Operating within a -55°C to +175°C junction temperature range, it dissipates up to 260 W in a D2PAK-3 package.

Feature Summary

Advanced trench gate field-stop structure for optimized efficiency
Positive VCE(sat) temperature coefficient for safe paralleling
Ultrafast soft recovery antiparallel diode
Short-circuit rated capability

Applications

High frequency converters
Motor drives
Power supplies

Procurement Notes

Verify component authenticity through authorized channels. Confirm datasheet revisions match design requirements. Ensure thermal management aligns with specified power dissipation limits. Check for end-of-life status before finalizing designs.

Selection Notes

Compare conduction losses against switching speed requirements. Evaluate thermal resistance for heat sink sizing. Consider parameter distribution tightness for parallel operation needs. Verify package compatibility with PCB layout constraints.

Part Context

Part of the HB series IGBT lineup designed for high-speed applications. Shares structural similarities with STGP30H60DF and STGWT30H60DFB. Utilizes silicon technology for robust performance in industrial environments.

Replacement Considerations

STGWT30H60DFB offers identical electrical characteristics and packaging. STGP30H60DF provides similar performance metrics. Verify pinout and thermal specifications when substituting.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.