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The STGB30M65DF2 is a single N-channel IGBT from the M series, utilizing trench gate field-stop technology. It features a collector-emitter voltage of 650 V and a continuous collector current of 60 A at 25 °C case temperature. The typical saturation voltage is 1.55 V at 30 A. It supports a maximum junction temperature of 175 °C and offers a minimum short-circuit withstand time of 6 µs. The device is housed in a D²PAK (TO-263) package with tape and reel packing.
Verify the specific ordering code against the manufacturer's official datasheet to ensure correct package type and environmental compliance grade. Confirm that the required short-circuit withstand time aligns with the application's fault protection requirements. Check for updated revision history to ensure compatibility with design specifications.
Select this component when high power density and efficient switching are required in inverter applications. Consider the thermal resistance values for heatsink design. Evaluate the gate charge characteristics against the driver capabilities to optimize switching speed and minimize losses.
This part belongs to the STMicroelectronics M series of IGBTs, designed for optimal balance between inverter system performance and efficiency. It shares core electrical characteristics with other members of the series but differs in packaging and current ratings.
STGW30M65DF2: Through-hole TO-247-3 package equivalent. STGP30M65DF2: Through-hole TO-220 package equivalent. Verify pinout and thermal management requirements when substituting.
The device has a minimum short-circuit withstand time of 6 µs at VCC = 400 V and VGE = 15 V.
Yes, it includes a soft and very fast-recovery antiparallel diode.
The maximum operating junction temperature is 175 °C.