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The STGD10NC60ST4 is a fast N-channel IGBT utilizing the PowerMESH™ process, designed for medium operating frequencies up to 5 kHz in hard switching applications. It features a DPAK (TO-252) surface-mount package with tape and reel packaging. Key electrical ratings include a collector-emitter voltage of 600 V, continuous collector current of 18 A at TC = 25°C, and gate-emitter voltage of ±20 V. The device operates within a junction temperature range of -55 to 150 °C, with a thermal resistance junction-to-case of 2.08 °C/W.
Verify component authenticity through authorized channels due to obsolete status. Confirm datasheet revision and environmental compliance specifications prior to integration. Ensure supply chain stability as availability may be restricted. Validate that the DPAK tape and reel packaging meets automated assembly requirements for the specific production line.
Select this component for designs requiring robust hard-switching capabilities at frequencies up to 5 kHz. Consider the 600 V rating and 18 A continuous current capacity against load requirements. Evaluate the DPAK package for thermal management needs, noting the 2.08 °C/W junction-to-case resistance. Verify compatibility with standard gate drive voltages of 15 V.
This part belongs to the STGD10NC60S series, which includes the TO-220 variant STGP10NC60S. Both utilize the same internal PowerMESH™ technology but differ in physical packaging and thermal characteristics. The STGD10NC60ST4 specifically denotes the DPAK surface-mount version supplied in tape and reel format for automated manufacturing processes.
Direct replacement options are limited due to the obsolete status. Review the STGP10NC60S if through-hole mounting is acceptable. Consult STMicroelectronics for updated PowerMESH™ family members that offer equivalent 600 V / 10 A specifications with modern packaging.