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The STGD3NB60HDT4 is an N-channel PowerMESH™ IGBT from STMicroelectronics, packaged in a DPAK (TO-252-3) surface-mount housing. It features a collector-emitter voltage rating of 600 V and a continuous collector current of 6 A at 100°C. The device integrates a TurboSwitch™ antiparallel diode with a forward current of 1.5 A. Key electrical parameters include a maximum saturation voltage of 2.8 V at 15 V gate drive and 3 A collector current. Total switching losses are specified at 100 µJ under standard test conditions.
Verify component authenticity through authorized distribution channels. Confirm the specific ordering suffix matches the required tape and reel packaging format. Ensure compliance with RoHS3 standards and check for any relevant environmental export classifications prior to final procurement decisions.
Select this component for designs requiring compact surface-mount solutions with integrated freewheeling diodes. Evaluate thermal resistance limits against expected power dissipation profiles. Consider the specific switching loss values when designing gate drive circuits for optimal efficiency at target operating frequencies.
This part belongs to the STGD3NB60HD family of PowerMESH™ IGBTs. The 'T4' suffix specifically denotes the tape and reel packaging configuration intended for automated assembly processes. This distinguishes it from tube-packaged variants within the same electrical specification family.
STGD3NB60HDT4 is marked as obsolete. Verify availability of direct replacements or evaluate alternative IGBTs with matching 600V ratings and DPAK footprints.
The datasheet specifies a typical short circuit withstand time of 5 microseconds for the S-family and 4 microseconds for the H-family.
The co-packaged TurboSwitch™ antiparallel diode offers very soft ultra-fast recovery, which helps reduce cross-conduction susceptibility and improves overall switching behavior.
The operating junction temperature range is specified from -55°C to +150°C.