STGH30H65DFB-2AG

STGH30H65DFB-2AG

$3.65
  • Description:IGBT TRENCH FS 650V 60A H2PAK-2
  • Series:-

SKU:a3541ddcf685 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT TRENCH FS 650V 60A H2PAK-2
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • IGBT Type:Trench Field Stop
  • Voltage - Collector Emitter Breakdown (Max):650 V
  • Current - Collector (Ic) (Max):60 A
  • Current - Collector Pulsed (Icm):90 A
  • Vce(on) (Max) @ Vge, Ic:2V @ 15V, 30A
  • Power - Max:260 W
  • Switching Energy:555µJ (on), 300µJ (off)
  • Input Type:Standard
  • Gate Charge:155 nC
  • Td (on/off) @ 25°C:24ns/170ns
  • Test Condition:400V, 30A, 10Ohm, 15V
  • Reverse Recovery Time (trr):28 ns
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
  • Supplier Device Package:H2PAK-2
  • Grade:Automotive
  • Qualification:AEC-Q101

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STGH30H65DFB-2AG

Overview

The STGH30H65DFB-2AG is an N-channel IGBT from the HB series, utilizing a trench gate field-stop structure. It features a 650 V collector-emitter voltage and a continuous collector current of 60 A at 25 °C case temperature. The device operates with a maximum junction temperature of 175 °C and includes a co-packaged antiparallel diode. Key electrical parameters include a typical VCE(sat) of 1.55 V at 30 A and a total switching energy of 855 µJ at 400 V. It is supplied in an H²PAK-2 surface-mount package.

Feature Summary

  • AEC-Q101 qualified for automotive reliability
  • Optimized high-speed switching performance
  • Slightly positive VCE(sat) temperature coefficient for safer paralleling
  • Soft and very fast recovery antiparallel diode

Applications

  • DC/DC converters for electric vehicles (EV) and hybrid electric vehicles (HEV)
  • HVAC and climate control systems

Procurement Notes

Verify the specific ordering code STGH30H65DFB-2AG against the manufacturer's official documentation to ensure correct component identification. Confirm that the H²PAK-2 package type and tape-and-reel packing method align with your automated assembly requirements. Check for any recent product change notifications or revision updates before finalizing procurement specifications.

Selection Notes

Select this component when designing circuits requiring AEC-Q101 qualification and high-frequency operation up to 175 °C junction temperature. Ensure the thermal management design accommodates the specified RthJC values. Verify that the gate drive circuitry supports the required ±20 V rating and that the load conditions remain within the forward bias safe operating area limits defined in the datasheet.

Part Context

This part belongs to the HB series of IGBTs developed by STMicroelectronics. The series utilizes an advanced proprietary trench gate field-stop structure designed to balance conduction and switching losses. It represents an evolution in efficiency optimization for frequency converters, specifically targeting applications where high speed and low thermal resistance are critical.

Replacement Considerations

Consult the manufacturer's official cross-reference data for verified substitutes. Ensure any replacement maintains the same voltage rating, current capacity, and package dimensions. Verify that alternative components also meet AEC-Q101 standards if automotive qualification is required for the application.

STGH30H65DFB-2AGSTGH30H65DFB-2AG
$3.65
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