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The STGW35HF60W is a 600 V, 35 A ultrafast IGBT manufactured by STMicroelectronics in a TO-247 package. It utilizes advanced planar technology to minimize tail current and reduce switching energy variation across temperatures. Key electrical parameters include a collector-emitter saturation voltage of 2.5 V at 20 A, a gate charge of 140 nC, and turn-off switching losses of 185 µJ under standard test conditions (VCC=400 V, IC=20 A). The device supports a maximum junction temperature of 150 °C and features an insulation withstand voltage of 2500 V RMS.
Verify the specific order code against the required package type, as the HF60W series includes variants in TO-220FP and TO-3PF packages. Confirm that the TO-247 configuration matches the thermal management requirements of the target design. Ensure compliance with environmental standards such as ECOPACK specifications if applicable to the project constraints.
Select this component for designs requiring stable switching performance over a wide temperature range. The TO-247 package provides a thermal resistance of 0.63 °C/W, suitable for moderate power dissipation up to 200 W at 25 °C case temperature. Consider the 150 A pulsed current rating for transient load handling capabilities within the safe operating area limits.
This part belongs to the STGxHF60W family of ultrafast IGBTs developed using new planar technology. The 'W' suffix specifically denotes products designed for high switching frequency operations exceeding 100 kHz. It shares core electrical characteristics with the STGF35HF60W and STGFW35HF60W models, differing primarily in physical packaging dimensions.
Direct replacements within the same family include STGF35HF60W (TO-220FP) and STGFW35HF60W (TO-3PF), provided the mechanical footprint allows adaptation. Cross-package substitution requires verifying thermal resistance differences and pinout compatibility.