TSM150NB04DCR RLG

TSM150NB04DCR RLG

$0.90
  • Description:MOSFET 2N-CH 40V 8A 8PDFN
  • Series:-

SKU:75874c3a42cb Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MOSFET 2N-CH 40V 8A 8PDFN
  • Series:-
  • Mfr:Taiwan Semiconductor Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Dual)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):40V
  • Current - Continuous Drain (Id) @ 25°C:8A (Ta), 38A (Tc)
  • Rds On (Max) @ Id, Vgs:15mOhm @ 8A, 10V
  • Vgs(th) (Max) @ Id:4V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:18nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:1132pF @ 20V
  • Power - Max:2W (Ta), 40W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerTDFN
  • Supplier Device Package:8-PDFN (5x6)
  • Grade:-
  • Qualification:-

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TSM150NB04DCR RLG

Overview

The TSM150NB04DCR RLG is a dual N-channel power MOSFET manufactured by Taiwan Semiconductor Corporation. It features a PDFN56 Dual package with a drain-source voltage (VDS) of 40V and a continuous drain current (ID) of 38A at 25°C case temperature. The device achieves a maximum on-resistance (RDS(on)) of 15mΩ at VGS=10V and ID=8A, or 28.6mΩ at VGS=7V and ID=6A. Key electrical parameters include a total gate charge (Qg) of 18nC at VGS=10V, an input capacitance (Ciss) of 1132pF, and a junction-to-case thermal resistance (RθJC) of 3.1°C/W. The component supports an operating junction temperature range from -55°C to +150°C.

Feature Summary

  • Dual N-Channel configuration for space-efficient circuit designs
  • Low on-resistance to minimize conductive losses
  • Optimized gate charge characteristics for fast switching performance
  • Validated through 100% Unclamped Inductive Switching (UIS) and gate resistance testing

Applications

  • BLDC Motor Control
  • Battery Power Management
  • DC-DC Converter
  • Secondary Synchronous Rectification

Procurement Notes

Verify the specific ordering code TSM150NB04DCR RLG against official Taiwan Semiconductor documentation to confirm the PDFN56 Dual package and reel quantity specifications. Ensure that environmental compliance requirements match the datasheet declarations regarding RoHS standards and halogen-free status according to IEC 61249-2-21 before finalizing procurement orders.

Selection Notes

Select this component when a compact dual N-channel solution is required for 40V applications. The low RDS(on) and optimized gate charge make it suitable for high-efficiency synchronous rectification and motor control circuits. Verify that the PCB layout accommodates the PDFN56 Dual footprint and provides adequate copper area to manage the specified thermal resistance values effectively.

Part Context

This part belongs to the TSM150 series of dual N-channel MOSFETs from Taiwan Semiconductor. It utilizes the PDFN56 Dual package, which integrates two independent N-channel devices in a single surface-mount form factor. This configuration allows designers to reduce board space compared to using discrete single-channel components while maintaining high current handling capabilities.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Engineers should consult the manufacturer's official documentation or authorized distributor databases to identify compatible alternatives based on matching electrical parameters and package dimensions.

FAQ

What is the maximum pulsed drain current for the TSM150NB04DCR?

The maximum pulsed drain current (IDM) is 152 A.

Does the TSM150NB04DCR support avalanche energy ratings?

Yes, the device has a single pulse avalanche energy (EAS) rating of 34 mJ under specified test conditions.

What is the reverse recovery time of the body diode?

The reverse recovery time (trr) is 14 ns when tested at IS = 8A and dI/dt = 100A/μs.

TSM150NB04DCR RLGTSM150NB04DCR RLG
$0.90
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